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HD3SS215IZQER

Texas Instruments

HD3SS215IZQER by Texas Instruments

HD3SS215IZQER by Texas Instruments is a consumer IC with 50 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage range of 3-3.6V. This IC is suitable for industrial applications requiring fine pitch and thin profile components.

Median Price

$2.170

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 278 parts In-Stock

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278

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$2.170

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Chip Stock

USA . 9,930 parts In-Stock

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Vyrian

USA . 8,734 parts In-Stock

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Digiode

USA . 4,129 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,976 parts In-Stock

1+ parts

$2.183

100+ parts

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$2.695

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1,976

$2.183

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$2.695

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ChromeModa Solutions

Germany . 5,524 parts In-Stock

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$2.453

100+ parts

$2.011

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5,524

$2.453

$2.011

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IDEA Electronic Components Group

UK . 1,916 parts In-Stock

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$2.453

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$2.208

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1,916

$2.453

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$2.208

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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20,000

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Northwest PG Solutions

USA . 2,370 parts In-Stock

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$3.410

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Corphita

USA . 1,047 parts In-Stock

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1,047

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Native Components

USA . 806 parts In-Stock

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$3.376

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806

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DigiPath Technology Company

USA . 752 parts In-Stock

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$2.212

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752

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Microchip USA

USA . 437 parts In-Stock

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Kepictronics

USA . 60 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the HD3SS215IZQER. This innovative consumer circuit IC offers a wide range of applications in various industries, delivering unmatched performance and efficiency. With a sleek package design and advanced technology, this product is sure to provide value and benefits to customers seeking top-notch solutions for their projects. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material provides good insulation and protection for the IC, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability allows for easy assembly onto PCBs, saving space and enabling efficient mass production.

Package Shape: SQUARE

Square package shape provides a compact form factor, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures the IC can withstand harsh environmental conditions.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement makes the IC suitable for low-power applications.

Technical Specifications

Other Function Consumer ICs HD3SS215IZQER attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B50

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

50

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

HD3SS215IZQER General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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