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HD3SS215IZQET

Texas Instruments

HD3SS215IZQET by Texas Instruments

HD3SS215IZQET by Texas Instruments is a consumer IC with 50 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage range of 3-3.6V. This IC is suitable for industrial applications requiring fine pitch and thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 9,800 parts In-Stock

1+ parts

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9,800

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Digiode

USA . 3,733 parts In-Stock

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3,733

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Vyrian

USA . 3,208 parts In-Stock

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3,208

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,221 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

$1.499

10k+ parts

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1,221

$0.156

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$1.499

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DigiPath Technology Company

USA . 1,454 parts In-Stock

1+ parts

$0.172

100+ parts

-

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1,454

$0.172

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IDEA Electronic Components Group

UK . 1,645 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

$0.158

10k+ parts

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1,645

$0.175

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$0.158

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ChromeModa Solutions

Germany . 1,479 parts In-Stock

1+ parts

$0.175

100+ parts

$0.144

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10k+ parts

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1,479

$0.175

$0.144

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Native Components

USA . 633 parts In-Stock

1+ parts

$2.043

100+ parts

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633

$2.043

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Northwest PG Solutions

USA . 67 parts In-Stock

1+ parts

$2.247

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67

$2.247

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AZTECH Wire

Italy . 313 parts In-Stock

1+ parts

$12.337

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313

$12.337

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One Stop Electronics

USA . 1,108 parts In-Stock

1+ parts

$12.800

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1,108

$12.800

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Corphita

USA . 1,413 parts In-Stock

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1,413

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the HD3SS215IZQET, a cutting-edge consumer circuit designed for a wide range of applications. This innovative IC boasts a grid array package with a very thin profile and fine pitch, making it suitable for advanced electronic devices. With a wide operating temperature range and top-notch terminal finish, this product ensures optimal performance in industrial settings. Trust Texas Instruments for high-quality solutions that deliver superior value and performance, setting your projects apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the integrated circuits inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto printed circuit boards, saving time and labor costs during manufacturing.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it suitable for compact and densely populated electronic devices.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is optimized for performance, efficiency, and cost-effectiveness in a wide range of consumer electronic products.

No. of Terminals: 50

With a high number of terminals, this IC can support complex circuit designs and functionalities, making it versatile for various consumer electronic applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch offers high density integration, enabling compact and high-performance electronic designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this IC can operate effectively in cold environments without any performance degradation.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish enhances conductivity, solderability, and corrosion resistance, ensuring a reliable electrical connection.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim profile and space-saving design, making it suitable for compact consumer electronic devices.

Width: 5 mm

The compact width of 5 mm facilitates efficient board layout and space utilization, optimizing the overall design of the electronic system.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3 V makes it compatible with a wide range of power sources, enhancing the versatility of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds minimizes heat exposure during assembly, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures reliable solder joints during assembly, contributing to the overall durability of the product.

Length: 5 mm

The compact length of 5 mm allows for a space-efficient design, ideal for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this IC meets stringent performance and reliability standards, making it suitable for demanding environments.

Terminal Form: BALL

The use of ball terminal form simplifies the surface-mount assembly process and ensures a secure and reliable connection to the circuit board.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting, allowing for more functionality in a smaller footprint, ideal for space-constrained devices.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, ensuring the IC can withstand typical manufacturing and storage conditions without degradation.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V provides flexibility in power source selection while ensuring safe operation within specified voltage limits.

Technical Specifications

Other Function Consumer ICs HD3SS215IZQET attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B50

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

50

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

HD3SS215IZQET General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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