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HD3SS215RTQR

Texas Instruments

HD3SS215RTQR by Texas Instruments

HD3SS215RTQR by Texas Instruments is a 56-terminal consumer IC with a package style of chip carrier. It operates b/w 0-70°C, has a min supply voltage of 3V, and supports up to 4 channels. This IC is ideal for applications requiring high-speed switching in compact electronic devices.

Median Price

$4.180

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,390 parts In-Stock

1+ parts

$2.973

100+ parts

$2.605

1k+ parts

$1.472

10k+ parts

-

13,390

$2.973

$2.605

$1.472

-

DigiKey

USA . 3,219 parts In-Stock

1+ parts

$4.180

100+ parts

$2.633

1k+ parts

$2.354

10k+ parts

$2.255

3,219

$4.180

$2.633

$2.354

$2.255

Mouser Electronics

USA . 1,783 parts In-Stock

1+ parts

$4.180

100+ parts

$2.640

1k+ parts

$2.360

10k+ parts

$2.280

1,783

$4.180

$2.640

$2.360

$2.280

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,632 parts In-Stock

1+ parts

$2.480

100+ parts

-

1k+ parts

-

10k+ parts

-

3,632

$2.480

-

-

-

Digiode

USA . 1,266 parts In-Stock

1+ parts

$2.824

100+ parts

-

1k+ parts

-

10k+ parts

-

1,266

$2.824

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 10,579 parts In-Stock

1+ parts

$0.980

100+ parts

$0.930

1k+ parts

$0.900

10k+ parts

-

10,579

$0.980

$0.930

$0.900

-

Native Components

USA . 832 parts In-Stock

1+ parts

$1.029

100+ parts

-

1k+ parts

-

10k+ parts

-

832

$1.029

-

-

-

Northwest PG Solutions

USA . 1,208 parts In-Stock

1+ parts

$1.132

100+ parts

-

1k+ parts

-

10k+ parts

-

1,208

$1.132

-

-

-

Corphita

USA . 684 parts In-Stock

1+ parts

$2.676

100+ parts

-

1k+ parts

-

10k+ parts

-

684

$2.676

-

-

-

Parana Technologies

USA . 1,604 parts In-Stock

1+ parts

$2.738

100+ parts

-

1k+ parts

$3.219

10k+ parts

-

1,604

$2.738

-

$3.219

-

DigiPath Technology Company

USA . 637 parts In-Stock

1+ parts

$3.014

100+ parts

$2.773

1k+ parts

-

10k+ parts

-

637

$3.014

$2.773

-

-

ChromeModa Solutions

Germany . 6,707 parts In-Stock

1+ parts

$3.076

100+ parts

$2.522

1k+ parts

-

10k+ parts

-

6,707

$3.076

$2.522

-

-

IDEA Electronic Components Group

UK . 1,739 parts In-Stock

1+ parts

$3.076

100+ parts

-

1k+ parts

$2.768

10k+ parts

-

1,739

$3.076

-

$2.768

-

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Lixinc

USA . 13,804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,804

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,158

-

-

-

-

Alle Elektronik GmbH

Germany . 4,772 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,772

-

-

-

-

Kepictronics

USA . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

440

-

-

-

-

iodParts Technologies Inc.

India . 131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

131

-

-

-

-

Overview

Discover the HD3SS215RTQR by Texas Instruments, a high-quality consumer IC designed for a wide range of applications. With a focus on reliability and performance, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for various electronic devices, this versatile chip offers customers unmatched value and benefits. Experience seamless connectivity and efficiency with the HD3SS215RTQR, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable consumer electronics.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of electronic circuits, increasing productivity and reducing manufacturing costs.

No. of Terminals: 56

Having 56 terminals provides versatility and flexibility in connecting to various external components or peripherals, enhancing the functionality of the consumer IC.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this consumer IC can perform reliably under normal operating conditions without overheating.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3V enables the consumer IC to operate efficiently even with lower power sources, making it compatible with a wide range of applications.

Technical Specifications

Other Function Consumer ICs HD3SS215RTQR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Trade Compliance

HD3SS215RTQR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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