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HD3SS214ZQER

Texas Instruments

HD3SS214ZQER by Texas Instruments

HD3SS214ZQER by Texas Instruments is a 50-terminal differential multiplexer with a 3.3V supply voltage, suitable for industrial applications. It features a very thin profile grid array package with a square shape and measures 5mm in length and width. With a max operating temperature of 105°C, it offers common output terminals and low supply current of 5mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,055 parts In-Stock

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Digiode

USA . 2,345 parts In-Stock

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SPM Sales

USA . 577 parts In-Stock

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577

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Distributors (Availability)

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Native Components

USA . 836 parts In-Stock

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$0.191

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$0.183

836

$0.191

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$0.183

Northwest PG Solutions

USA . 275 parts In-Stock

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$0.210

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$0.185

275

$0.210

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$0.185

One Stop Electronics

USA . 987 parts In-Stock

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$2.500

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987

$2.500

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Parana Technologies

USA . 618 parts In-Stock

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$9.009

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$9.679

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618

$9.009

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$9.679

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DigiPath Technology Company

USA . 232 parts In-Stock

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$9.920

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$9.920

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ChromeModa Solutions

Germany . 4,719 parts In-Stock

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$10.122

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$8.300

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IDEA Electronic Components Group

UK . 1,939 parts In-Stock

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$10.122

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$9.616

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$9.110

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1,939

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$9.110

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AZTECH Wire

Italy . 683 parts In-Stock

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$10.711

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Lixinc

USA . 16,085 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,494 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,329 parts In-Stock

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Corphita

USA . 1,172 parts In-Stock

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Microchip USA

USA . 379 parts In-Stock

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379

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Overview

Experience seamless connectivity like never before with the Texas Instruments HD3SS214ZQER multiplexer. Crafted with precision and expertise, this high-quality device offers unparalleled performance and reliability. Whether you're in need of signal routing, power management, or data switching, this versatile product has you covered. Say goodbye to connectivity issues and hello to smooth operations with the Texas Instruments HD3SS214ZQER – your ultimate solution for all multiplexing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability, making this product suitable for various industrial applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort in the assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

Operates efficiently at a low voltage, reducing power consumption and improving overall energy efficiency.

No. of Terminals: 50

Offers a high number of terminals, providing versatility in connecting multiple components and devices.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, ensuring reliable performance in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish enhances conductivity and corrosion resistance, prolonging the product's lifespan.

Output (V): COMMON OUTPUT

Common output simplifies signal routing and minimizes complexity in circuit designs.

Width (mm): 5 mm

Compact width saves space on the circuit board, ideal for applications with limited area.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes the risk of thermal damage during installation or rework processes.

Temperature Grade: INDUSTRIAL

Designed to meet industry standards for temperature range, ensuring reliability in industrial environments.

Technical Specifications

Multiplexers & Switches HD3SS214ZQER attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B50

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

50

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

COMMON OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

HD3SS214ZQER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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