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HD3SS3212RKSRQ1

Texas Instruments

HD3SS3212RKSRQ1 by Texas Instruments

Texas Instruments' HD3SS3212RKSRQ1 is a 20-terminal chip carrier switch with AEC-Q100 screening for industrial use. It operates b/w -40 to 105°C, with a supply voltage range of 2.7-3.6V and bandwidth of 8000 kHz. This differential multiplexer has no-lead terminals and is suitable for high-frequency signal routing applications.

Median Price

$2.670

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,504 parts In-Stock

1+ parts

$2.052

100+ parts

$1.798

1k+ parts

$1.016

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-

2,504

$2.052

$1.798

$1.016

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DigiKey

USA . 1,883 parts In-Stock

1+ parts

$2.670

100+ parts

$1.632

1k+ parts

$1.445

10k+ parts

$1.337

1,883

$2.670

$1.632

$1.445

$1.337

Mouser Electronics

USA . 1,273 parts In-Stock

1+ parts

$2.670

100+ parts

$1.640

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-

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1,273

$2.670

$1.640

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.293

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-

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10

$1.293

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Digiode

USA . 4,436 parts In-Stock

1+ parts

$1.949

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4,436

$1.949

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Maritex

Poland . 54 parts In-Stock

1+ parts

$2.891

100+ parts

$1.815

1k+ parts

$1.472

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54

$2.891

$1.815

$1.472

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Classic Components Corporation

USA . 48,000 parts In-Stock

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48,000

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Chip Stock

USA . 15,500 parts In-Stock

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15,500

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Vyrian

USA . 3,009 parts In-Stock

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3,009

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Prism Electronics

USA . 15 parts In-Stock

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15

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,713 parts In-Stock

1+ parts

$1.293

100+ parts

-

1k+ parts

-

10k+ parts

$1.267

4,713

$1.293

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-

$1.267

Argo Parts USA

USA . 1,915 parts In-Stock

1+ parts

$1.293

100+ parts

-

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1,915

$1.293

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.293

100+ parts

$1.267

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1,000

$1.293

$1.267

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Semicontronic

India . 2,653 parts In-Stock

1+ parts

$1.740

100+ parts

$1.696

1k+ parts

$1.688

10k+ parts

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2,653

$1.740

$1.696

$1.688

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Ampacity Inc.

Singapore . 2,643 parts In-Stock

1+ parts

$1.740

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2,643

$1.740

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Corphita

USA . 3,420 parts In-Stock

1+ parts

$1.847

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3,420

$1.847

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Parana Technologies

USA . 1,863 parts In-Stock

1+ parts

$7.552

100+ parts

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$8.063

10k+ parts

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1,863

$7.552

-

$8.063

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DigiPath Technology Company

USA . 848 parts In-Stock

1+ parts

$8.315

100+ parts

$7.650

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848

$8.315

$7.650

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ChromeModa Solutions

Germany . 1,973 parts In-Stock

1+ parts

$8.485

100+ parts

$6.958

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1,973

$8.485

$6.958

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IDEA Electronic Components Group

UK . 603 parts In-Stock

1+ parts

$8.485

100+ parts

$8.061

1k+ parts

$7.636

10k+ parts

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603

$8.485

$8.061

$7.636

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Corohmni

South Africa . 548 parts In-Stock

1+ parts

$13.917

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548

$13.917

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Lixinc

USA . 1,753 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,200 parts In-Stock

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1,200

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Overview

Enhance your electronics projects with the HD3SS3212RKSRQ1 from Texas Instruments, a leading manufacturer known for superior quality and reliability. This multiplexer & switch offers seamless performance in a variety of applications, providing customers with unmatched value and benefits. With its compact design, wide operating temperature range, and high channel count, this chip carrier is the perfect solution for your industrial needs. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and reliability for the product.

Surface Mount:

YES - Allows for easy installation and integration into various applications.

Screening Level:

AEC-Q100 - Ensures high reliability and quality standards for automotive applications.

Package Shape:

RECTANGULAR - Offers a compact and space-saving design for efficiency.

No. of Terminals:

20 - Provides multiple connection points for increased functionality.

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE - Offers a sleek and low-profile design for space-constrained applications.

Maximum Operating Temperature:

105 °C - Ensures stable performance even in high-temperature environments.

Minimum Operating Temperature:

40 °C - Suitable for operation in extreme cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides excellent conductivity and corrosion resistance for long-lasting use.

Terminal Position:

QUAD - Allows for easy connection and integration with other components.

Maximum Seated Height:

1 mm - Ideal for applications with limited vertical space.

Width (mm):

2.5 mm - Compact design for easy installation in tight spaces.

Other IC type:

DIFFERENTIAL MULTIPLEXER - Enables efficient signal routing and processing.

Minimum Supply Voltage (Vsup):

2.7 V - Suitable for low-power applications.

Maximum Time At Peak Reflow Temperature (s):

30 - Resistant to high-temperature soldering processes for durability.

Peak Reflow Temperature °C:

260 - Withstands high reflow temperatures during assembly.

Length:

4.5 mm - Compact size for easy integration into electronic systems.

Temperature Grade:

INDUSTRIAL - Designed for reliable performance in industrial environments.

Maximum Supply Current (Isup):

0.8 mA - Low power consumption for energy-efficient operation.

No. of Channels:

2 - Provides multiple signal paths for versatile applications.

Nominal Bandwidth:

8000 kHz - Accommodates high-frequency signals for data processing.

Terminal Form:

NO LEAD - Lead-free design for environmental sustainability.

Terminal Pitch:

0.5 mm - Close terminal spacing for a compact footprint.

Moisture Sensitivity Level (MSL):

2 - Resistant to moisture ingress for long-term reliability.

Maximum Supply Voltage (Vsup):

3.6 V - Compatible with a wide range of power sources for flexibility.

Technical Specifications

Multiplexers & Switches HD3SS3212RKSRQ1 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

8000 kHz

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

.8 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.5 mm

Trade Compliance

HD3SS3212RKSRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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