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HD3SS460RNHT

Texas Instruments

HD3SS460RNHT by Texas Instruments

HD3SS460RNHT by Texas Instruments is a 30-terminal single-ended multiplexer with a 3.3V supply voltage and 4 channels. It features a max on-state resistance of 14 ohm, separate outputs, and operates in commercial temperature grades. Ideal for applications requiring high bandwidth (2700 kHz) and low off-state isolation (25 dB).

Median Price

$2.231

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 22 parts In-Stock

1+ parts

$0.920

100+ parts

-

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22

$0.920

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Texas Instruments

USA . 33,000 parts In-Stock

1+ parts

$2.231

100+ parts

$1.843

1k+ parts

$0.996

10k+ parts

-

33,000

$2.231

$1.843

$0.996

-

DigiKey

USA . 493 parts In-Stock

1+ parts

$2.970

100+ parts

$1.831

1k+ parts

$1.644

10k+ parts

$1.533

493

$2.970

$1.831

$1.644

$1.533

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,116 parts In-Stock

1+ parts

$0.874

100+ parts

-

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3,116

$0.874

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Chip Stock

USA . 15,522 parts In-Stock

1+ parts

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15,522

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Vyrian

USA . 7,017 parts In-Stock

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7,017

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

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500

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 11,151 parts In-Stock

1+ parts

$0.780

100+ parts

$0.760

1k+ parts

$0.757

10k+ parts

-

11,151

$0.780

$0.760

$0.757

-

Ampacity Inc.

Singapore . 10,780 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

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10,780

$0.780

-

-

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Corphita

USA . 3,108 parts In-Stock

1+ parts

$0.828

100+ parts

-

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3,108

$0.828

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-

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Corohmni

South Africa . 537 parts In-Stock

1+ parts

$1.035

100+ parts

-

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537

$1.035

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Parana Technologies

USA . 1,028 parts In-Stock

1+ parts

$11.330

100+ parts

-

1k+ parts

$11.759

10k+ parts

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1,028

$11.330

-

$11.759

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DigiPath Technology Company

USA . 1,359 parts In-Stock

1+ parts

$12.475

100+ parts

$11.477

1k+ parts

-

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1,359

$12.475

$11.477

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ChromeModa Solutions

Germany . 3,865 parts In-Stock

1+ parts

$12.730

100+ parts

$10.439

1k+ parts

-

10k+ parts

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3,865

$12.730

$10.439

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IDEA Electronic Components Group

UK . 1,786 parts In-Stock

1+ parts

$12.730

100+ parts

$12.094

1k+ parts

$11.457

10k+ parts

-

1,786

$12.730

$12.094

$11.457

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Lixinc

USA . 9,688 parts In-Stock

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9,688

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Argo Parts USA

USA . 2,793 parts In-Stock

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2,793

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Continental Prestige Electronics

USA . 2,647 parts In-Stock

1+ parts

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2,647

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A-Z Elektronik GmbH

Germany . 1,000 parts In-Stock

1+ parts

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1,000

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Discover the ultimate solution for your multiplexing and switching needs with the HD3SS460RNHT by Texas Instruments. Crafted with precision and reliability, this versatile chip carrier offers seamless performance in applications such as data communication, industrial automation, and consumer electronics. With a nominal bandwidth of 2700 kHz and a maximum off-state isolation of 25 dB, this high-quality product ensures optimal functionality and efficiency. Elevate your projects with the superior engineering and innovation that Texas Instruments is renowned for, and experience the unmatched value and benefits that the HD3SS460RNHT brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the multiplexer, ensuring reliable performance over time.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3V makes this multiplexer compatible with a wide range of systems and applications.

No. of Terminals: 30

Having 30 terminals provides flexibility in connecting various input and output devices, enhancing the versatility of the multiplexer.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this multiplexer is suitable for use in a variety of environments and conditions without overheating.

Maximum On-state Resistance (Ron): 14 ohm

Low on-state resistance ensures minimal signal loss and distortion, maintaining signal integrity and accuracy in data transmission.

No. of Channels: 4

Having 4 channels allows simultaneous switching between multiple input signals, making this multiplexer ideal for applications requiring signal routing and selection.

Technical Specifications

Multiplexers & Switches HD3SS460RNHT attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

2700 kHz

JESD-30 Code:

R-PQCC-N30

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

Normal Position (V):

NO

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

30

Nominal Off-state Isolation:

25 dB

Maximum On-state Resistance (Ron):

14 ohm

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.9 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

1000 ns

Maximum Switch-on Time:

3000 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.5 mm

Trade Compliance

HD3SS460RNHT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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