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HD3SS460IRNHT

Texas Instruments

HD3SS460IRNHT by Texas Instruments

HD3SS460IRNHT by Texas Instruments is a 30-terminal single-ended multiplexer with a nominal voltage of 3.3V and max operating temperature of 85°C. It features a max on-state resistance of 14 ohm, suitable for industrial applications requiring high-speed switching up to 2700 kHz bandwidth.

Median Price

$2.782

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,747 parts In-Stock

1+ parts

$2.264

100+ parts

$1.984

1k+ parts

$1.121

10k+ parts

-

9,747

$2.264

$1.984

$1.121

-

DigiKey

USA . 106 parts In-Stock

1+ parts

$3.300

100+ parts

$2.047

1k+ parts

$1.842

10k+ parts

$1.765

106

$3.300

$2.047

$1.842

$1.765

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,016 parts In-Stock

1+ parts

$2.151

100+ parts

-

1k+ parts

-

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-

2,016

$2.151

-

-

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Vyrian

USA . 8,360 parts In-Stock

1+ parts

-

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-

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-

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8,360

-

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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-

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,121 parts In-Stock

1+ parts

$1.457

100+ parts

-

1k+ parts

-

10k+ parts

-

1,121

$1.457

-

-

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$1.463

100+ parts

$1.331

1k+ parts

$1.200

10k+ parts

-

450

$1.463

$1.331

$1.200

-

Ampacity Inc.

Singapore . 4,455 parts In-Stock

1+ parts

$1.920

100+ parts

-

1k+ parts

-

10k+ parts

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4,455

$1.920

-

-

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Semicontronic

India . 4,445 parts In-Stock

1+ parts

$1.920

100+ parts

$1.872

1k+ parts

$1.862

10k+ parts

-

4,445

$1.920

$1.872

$1.862

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Corphita

USA . 3,871 parts In-Stock

1+ parts

$2.038

100+ parts

-

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-

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3,871

$2.038

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-

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Parana Technologies

USA . 15 parts In-Stock

1+ parts

$9.226

100+ parts

-

1k+ parts

$9.867

10k+ parts

-

15

$9.226

-

$9.867

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DigiPath Technology Company

USA . 1,816 parts In-Stock

1+ parts

$10.159

100+ parts

$9.346

1k+ parts

-

10k+ parts

-

1,816

$10.159

$9.346

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ChromeModa Solutions

Germany . 5,109 parts In-Stock

1+ parts

$10.366

100+ parts

$8.500

1k+ parts

-

10k+ parts

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5,109

$10.366

$8.500

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IDEA Electronic Components Group

UK . 1,739 parts In-Stock

1+ parts

$10.366

100+ parts

$9.848

1k+ parts

$9.329

10k+ parts

-

1,739

$10.366

$9.848

$9.329

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Argo Parts USA

USA . 1,629 parts In-Stock

1+ parts

-

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1,629

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Bastille Electronics

Australia . 700 parts In-Stock

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700

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Continental Prestige Electronics

USA . 291 parts In-Stock

1+ parts

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291

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Overview

Enhance your electronic design projects with the HD3SS460IRNHT by Texas Instruments. Known for their high-quality products, Texas Instruments offers this multiplexer/switch that is perfect for a wide range of applications. With its compact size, low power consumption, and industrial-grade temperature rating, this product provides customers with reliable performance and flexibility. Whether you're working on consumer electronics or industrial automation systems, the HD3SS460IRNHT delivers the value and benefits you need to succeed in your project. Elevate your designs with this top-of-the-line solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer.

Surface Mount: YES

Allows for easy and convenient PCB assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Optimal voltage for efficient operation of the multiplexer.

No. of Terminals: 30

Provides versatility and flexibility for connecting to various external devices.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Enhances conductivity and reduces the risk of corrosion for long-lasting use.

Output (V): SEPARATE OUTPUT

Allows for individual control of each output channel.

Maximum Seated Height: 0.8 mm

Low profile design for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications that require reliable performance in harsh conditions.

Nominal Bandwidth: 2700 kHz

Provides high-speed data transmission for efficient signal processing.

Technical Specifications

Multiplexers & Switches HD3SS460IRNHT attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

2700 kHz

JESD-30 Code:

R-PQCC-N30

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

Normal Position (V):

NO

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

30

Nominal Off-state Isolation:

25 dB

Maximum On-state Resistance (Ron):

14 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.9 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

1000 ns

Maximum Switch-on Time:

3000 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.5 mm

Trade Compliance

HD3SS460IRNHT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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