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HD3SS214IZQER

Texas Instruments

HD3SS214IZQER by Texas Instruments

HD3SS214IZQER by Texas Instruments is a 50-terminal differential multiplexer with a supply voltage of 3.3V, suitable for industrial applications. It features a very thin profile package style, operates b/w -40 to 105°C, and has a peak reflow temperature of 260°C. Ideal for common output requirements in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,283 parts In-Stock

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Vyrian

USA . 2,261 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 94 parts In-Stock

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$0.761

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94

$0.761

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Northwest PG Solutions

USA . 1,833 parts In-Stock

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$0.837

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1,833

$0.837

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Ampacity Inc.

Singapore . 1,115 parts In-Stock

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$4.500

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$4.500

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One Stop Electronics

USA . 1,227 parts In-Stock

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$6.500

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$6.500

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Semicontronic

India . 756 parts In-Stock

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$6.500

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$6.338

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$6.305

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756

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 883 parts In-Stock

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$14.776

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883

$14.776

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Parana Technologies

USA . 1,867 parts In-Stock

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$21.703

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$22.136

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$21.703

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ChromeModa Solutions

Germany . 2,090 parts In-Stock

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$24.385

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$19.996

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$24.385

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IDEA Electronic Components Group

UK . 1,801 parts In-Stock

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$24.385

100+ parts

$23.166

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$21.946

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1,801

$24.385

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$21.946

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DigiPath Technology Company

USA . 2,370 parts In-Stock

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$21.986

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Corphita

USA . 1,008 parts In-Stock

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Corohmni

South Africa . 435 parts In-Stock

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Microchip USA

USA . 209 parts In-Stock

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Overview

Experience seamless and reliable signal switching with the HD3SS214IZQER by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and performance. Ideal for applications in multiplexers and switches, this product offers unparalleled value and benefits to customers. With its advanced features and durable construction, the HD3SS214IZQER ensures smooth operation and enhanced efficiency in various industrial settings. Upgrade your systems today with Texas Instruments' innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the multiplexer, making it suitable for various environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the multiplexer onto a circuit board, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with a wide range of electronic systems, making it versatile for different applications.

No. of Terminals: 50

With a high number of terminals, this multiplexer offers the capability to connect to multiple input or output channels, increasing the flexibility and functionality of the system.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the multiplexer to be used in demanding industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the multiplexer can function reliably even in extremely cold conditions, enhancing its reliability and durability.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper terminal finish provides good conductivity and reliability for the connections, ensuring stable performance over time.

Output (V): COMMON OUTPUT

Having a common output simplifies the signal routing and selection process, making the multiplexer easier to use in various applications.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a compact and space-saving design, ideal for applications where size constraints are a consideration.

Width (mm): 5 mm

The narrow width of 5mm enables the multiplexer to be integrated into tight spaces or dense layouts, maximizing the use of available board space.

Other IC type: DIFFERENTIAL MULTIPLEXER

The differential multiplexer design offers improved noise rejection and signal integrity, making it suitable for high-precision and sensitive applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this multiplexer is less susceptible to moisture-related damage, ensuring long-term reliability in humid environments.

Technical Specifications

Multiplexers & Switches HD3SS214IZQER attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B50

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

50

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

COMMON OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

HD3SS214IZQER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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