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F28386DZWTQ

Texas Instruments

F28386DZWTQ by Texas Instruments

The Texas Instruments F28386DZWTQ microcontroller features a 32-bit CPU, 524288 ROM words, and 24-Ch 12-Bit ADC channels. Ideal for automotive applications with CAN, I2C, SPI connectivity options. Operates at -40 to 125 °C temperature range with low power mode and on-chip program ROM width of 16 bits.

Median Price

$40.590

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 479 parts In-Stock

1+ parts

$23.726

100+ parts

$21.090

1k+ parts

$15.507

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479

$23.726

$21.090

$15.507

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Mouser Electronics

USA . 233 parts In-Stock

1+ parts

$40.590

100+ parts

$29.260

1k+ parts

$28.070

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233

$40.590

$29.260

$28.070

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DigiKey

USA . 44 parts In-Stock

1+ parts

$40.590

100+ parts

$29.264

1k+ parts

$28.079

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44

$40.590

$29.264

$28.079

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Distributors (In-Stock)

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Digiode

USA . 883 parts In-Stock

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$22.540

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883

$22.540

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Nova Conductors

Japan . 500 parts In-Stock

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$28.280

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$28.280

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Vyrian

USA . 7,782 parts In-Stock

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Chip Stock

USA . 4,405 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 392 parts In-Stock

1+ parts

$12.819

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-

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392

$12.819

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Semicontronic

India . 378 parts In-Stock

1+ parts

$20.170

100+ parts

$19.666

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$19.565

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378

$20.170

$19.666

$19.565

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Ampacity Inc.

Singapore . 262 parts In-Stock

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$20.170

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Corphita

USA . 4,844 parts In-Stock

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$21.353

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Advanced Electronics

New Zealand . 78 parts In-Stock

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$25.656

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$24.373

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$24.373

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78

$25.656

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$24.373

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Aranea Global

USA . 50 parts In-Stock

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$27.714

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$26.606

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$27.714

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$26.606

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Continental Prestige Electronics

USA . 992 parts In-Stock

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$28.280

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$27.714

992

$28.280

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$27.714

Corohmni

South Africa . 301 parts In-Stock

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$37.263

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Parana Technologies

USA . 1,737 parts In-Stock

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$43.516

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DigiPath Technology Company

USA . 2,377 parts In-Stock

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$47.916

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$44.083

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$47.916

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ChromeModa Solutions

Germany . 2,060 parts In-Stock

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$48.894

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$40.093

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$48.894

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IDEA Electronic Components Group

UK . 1,191 parts In-Stock

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$48.894

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$46.449

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$44.005

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$48.894

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$44.005

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Microchip USA

USA . 2,746 parts In-Stock

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$56.920

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$55.930

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$55.440

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$54.940

2,746

$56.920

$55.930

$55.440

$54.940

Argo Parts USA

USA . 4,352 parts In-Stock

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iodParts Technologies Inc.

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Authorized Procurement Solutions

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Lixinc

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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$0.025

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$0.025

Overview

Discover the power and precision of the F28386DZWTQ microcontroller by Texas Instruments, a game-changer in the world of automotive technology. With its cutting-edge design and top-of-the-line features, this device offers unparalleled performance and reliability. From its extensive connectivity options to its low power mode, the F28386DZWTQ is the ideal choice for applications requiring superior speed and efficiency. Trust in Texas Instruments' legacy of excellence and innovation, and elevate your projects to new heights with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 1.26 V

Allows for a higher power input, offering versatility in different circuit designs.

No. of Timers: 3

Multiple timers allow for precise timing control in various applications, enhancing the microcontroller's functionality.

ADC Channels: YES

Having Analog to Digital Convertor channels enables the microcontroller to interface with analog sensors, expanding its range of applications.

Connectivity: CAN(3), I2C(2), SCI(4), SPI(4), SSI, UART, USB

With various connectivity options, this microcontroller can easily communicate with other devices and systems, making it versatile for different projects.

Technical Specifications

Microcontrollers F28386DZWTQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of External Interrupts:

5

No. of I/O Lines:

169

No. of Terminals:

337

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

346112

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Current:

475 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(2), SCI(4), SPI(4), SSI, UART, USB

Peripherals:

AES, DMA(6), POR, PWM(32), TEMPERATURE SENSOR, TIMER(3), QEP(3), WDT

Analog To Digital Convertors:

24-Ch 12-Bit, 24-Ch 16-Bit

Trade Compliance

F28386DZWTQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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