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F28384DZWTS

Texas Instruments

F28384DZWTS by Texas Instruments

Texas Instruments F28384DZWTS is a 32-bit microcontroller with Cortex-M4 CPU, offering 24-Ch 16-Bit ADC and 3-Ch 12-Bit DAC. Ideal for automotive applications, it features CAN(3), I2C(3), SCI(4), SPI(4) connectivity options and operates at up to 20 MHz clock frequency.

Median Price

$26.820

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 657 parts In-Stock

1+ parts

$19.339

100+ parts

$16.893

1k+ parts

$11.650

10k+ parts

-

657

$19.339

$16.893

$11.650

-

Mouser Electronics

USA . 124 parts In-Stock

1+ parts

$34.300

100+ parts

$22.910

1k+ parts

$21.660

10k+ parts

-

124

$34.300

$22.910

$21.660

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$17.573

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$17.573

-

-

-

Digiode

USA . 4,536 parts In-Stock

1+ parts

$18.372

100+ parts

-

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-

10k+ parts

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4,536

$18.372

-

-

-

Vyrian

USA . 6,189 parts In-Stock

1+ parts

-

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-

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6,189

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-

-

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Sensible Micro Corp

USA . 264 parts In-Stock

1+ parts

-

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-

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-

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264

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 513 parts In-Stock

1+ parts

$7.135

100+ parts

-

1k+ parts

-

10k+ parts

-

513

$7.135

-

-

-

Ampacity Inc.

Singapore . 400 parts In-Stock

1+ parts

$16.440

100+ parts

-

1k+ parts

-

10k+ parts

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400

$16.440

-

-

-

Semicontronic

India . 343 parts In-Stock

1+ parts

$16.440

100+ parts

$16.029

1k+ parts

$15.947

10k+ parts

-

343

$16.440

$16.029

$15.947

-

Corphita

USA . 2,134 parts In-Stock

1+ parts

$17.405

100+ parts

-

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-

10k+ parts

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2,134

$17.405

-

-

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Continental Prestige Electronics

USA . 6,394 parts In-Stock

1+ parts

$17.573

100+ parts

-

1k+ parts

-

10k+ parts

$17.221

6,394

$17.573

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-

$17.221

Netroflash

USA . 500 parts In-Stock

1+ parts

$17.573

100+ parts

-

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-

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500

$17.573

-

-

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Corohmni

South Africa . 66 parts In-Stock

1+ parts

$33.961

100+ parts

-

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66

$33.961

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-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$41.001

100+ parts

$38.951

1k+ parts

$38.951

10k+ parts

-

1,000

$41.001

$38.951

$38.951

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Parana Technologies

USA . 1,990 parts In-Stock

1+ parts

$53.695

100+ parts

-

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-

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1,990

$53.695

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-

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ChromeModa Solutions

Germany . 6,568 parts In-Stock

1+ parts

$60.331

100+ parts

$49.471

1k+ parts

-

10k+ parts

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6,568

$60.331

$49.471

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IDEA Electronic Components Group

UK . 1,798 parts In-Stock

1+ parts

$60.331

100+ parts

$57.314

1k+ parts

$54.298

10k+ parts

-

1,798

$60.331

$57.314

$54.298

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

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2,000

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-

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DigiPath Technology Company

USA . 1,956 parts In-Stock

1+ parts

-

100+ parts

$54.394

1k+ parts

-

10k+ parts

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1,956

-

$54.394

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Argo Parts USA

USA . 1,907 parts In-Stock

1+ parts

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1,907

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Robosynatics

Brazil . 250 parts In-Stock

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250

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-

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Lucentia Tech

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$0.065

1k+ parts

$0.065

10k+ parts

$0.065

250

-

$0.065

$0.065

$0.065

Overview

Elevate your projects with the cutting-edge F28384DZWTS microcontroller by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers a versatile solution for a wide range of applications. With its advanced features and high performance, this microcontroller offers value, efficiency, and reliability to customers looking to take their designs to the next level. Explore the possibilities and experience the benefits of the F28384DZWTS in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the components inside, making it a reliable choice.

Surface Mount: YES

This feature allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

Maximum Supply Voltage: 1.26 V

This voltage range ensures compatibility with various power sources, giving flexibility in using the product.

On Chip Data RAM Width: 16

The wide RAM width allows for efficient data processing, enhancing the performance of the microcontroller.

Address Bus Width: 20

The broad address bus width enables the microcontroller to access a large memory space quickly and efficiently.

Package Shape: SQUARE

The square shape facilitates easy mounting on PCBs, optimizing space utilization and design aesthetics.

Bit Size: 32

The high bit size offers enhanced processing capabilities, making it suitable for handling complex tasks efficiently.

DAC Channels: YES

The presence of DAC channels allows for analog signal generation, expanding the range of applications for the microcontroller.

No. of Terminals: 337

The abundance of terminals provides ample connectivity options, making it versatile for multiple external devices.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers robust construction and compact size, making it suitable for space-constrained applications.

Technical Specifications

Microcontrollers F28384DZWTS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ADC CAN BE CONFIGURED TO 12-BIT ALSO

Address Bus Width:

20

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of External Interrupts:

5

No. of I/O Lines:

169

No. of Serial I/Os:

2

No. of Terminals:

337

No. of Timers:

9

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

346112

RAM Words:

173056

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Current:

475 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Connectivity:

CAN(3), I2C(3), SCI(4), SPI(4), SSI, UART, USB

Peripherals:

DMA(44), TIMER(9), WDT(5)

Analog To Digital Convertors:

24-Ch 16-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

F28384DZWTS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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