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F28388DZWTSR

Texas Instruments

F28388DZWTSR by Texas Instruments

F28388DZWTSR by Texas Instruments is a 32-bit microcontroller with 24-Ch 16-Bit ADC, 3-Ch 12-Bit DAC, and 346112 bytes of RAM. Ideal for automotive applications, it offers a max clock frequency of 100 MHz and operates in temperatures ranging from -40 to 125 °C. Connectivity options include CAN(3), I2C(3), SCI(4), SPI(4), SSI, UART, USB.

Median Price

$27.724

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,181 parts In-Stock

1+ parts

$22.659

100+ parts

$19.793

1k+ parts

$13.650

10k+ parts

-

8,181

$22.659

$19.793

$13.650

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Mouser Electronics

USA . 1,091 parts In-Stock

1+ parts

$32.790

100+ parts

$23.300

1k+ parts

$22.430

10k+ parts

-

1,091

$32.790

$23.300

$22.430

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$20.475

100+ parts

-

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50

$20.475

-

-

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Digiode

USA . 604 parts In-Stock

1+ parts

$21.526

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-

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604

$21.526

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Maritex

Poland . 6,523 parts In-Stock

1+ parts

$28.252

100+ parts

$18.260

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-

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6,523

$28.252

$18.260

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Chip Stock

USA . 10,820 parts In-Stock

1+ parts

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Vyrian

USA . 1,966 parts In-Stock

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1,966

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,366 parts In-Stock

1+ parts

$19.260

100+ parts

$18.778

1k+ parts

$18.682

10k+ parts

-

4,366

$19.260

$18.778

$18.682

-

Ampacity Inc.

Singapore . 4,189 parts In-Stock

1+ parts

$19.260

100+ parts

-

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4,189

$19.260

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Corphita

USA . 3,426 parts In-Stock

1+ parts

$20.393

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-

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3,426

$20.393

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Continental Prestige Electronics

USA . 6,111 parts In-Stock

1+ parts

$20.475

100+ parts

-

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$20.066

6,111

$20.475

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-

$20.066

Netroflash

USA . 500 parts In-Stock

1+ parts

$20.475

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$20.066

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-

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500

$20.475

$20.066

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Parana Technologies

USA . 2,354 parts In-Stock

1+ parts

$41.824

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2,354

$41.824

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$44.696

100+ parts

$42.461

1k+ parts

$42.461

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5,000

$44.696

$42.461

$42.461

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ChromeModa Solutions

Germany . 3,210 parts In-Stock

1+ parts

$46.993

100+ parts

$38.534

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3,210

$46.993

$38.534

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IDEA Electronic Components Group

UK . 2,223 parts In-Stock

1+ parts

$46.993

100+ parts

$44.643

1k+ parts

$42.294

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2,223

$46.993

$44.643

$42.294

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Corohmni

South Africa . 137 parts In-Stock

1+ parts

$65.182

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137

$65.182

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,246 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Modulus Dynamics

Lithuania . 600 parts In-Stock

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600

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DigiPath Technology Company

USA . 455 parts In-Stock

1+ parts

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$42.369

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455

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$42.369

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Robosynatics

Brazil . 450 parts In-Stock

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450

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Lucentia Tech

USA . 450 parts In-Stock

1+ parts

-

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$0.134

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$0.134

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$0.134

450

-

$0.134

$0.134

$0.134

Overview

Discover the innovative F28388DZWTSR microcontroller by Texas Instruments, a top-tier manufacturer in the industry. This versatile device is perfect for a wide range of applications, offering unmatched quality and performance. With advanced features like multiple DAC and ADC channels, extensive peripherals, and high-speed connectivity options, this microcontroller provides exceptional value to customers seeking reliable and efficient solutions. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

Surface Mount: YES

Saves space on PCB and allows for efficient assembly.

Maximum Supply Voltage: 1.26 V

Efficient power usage and suitable for low power applications.

Address Bus Width: 13

Allows for efficient data transfer and memory addressing.

Package Shape: SQUARE

Uniform shape for easy placement on PCB and space-saving design.

Bit Size: 32

High processing capability for handling complex tasks.

DAC Channels: YES

Supports analog output functionality for diverse applications.

No. of Terminals: 337

Provides ample connectivity options for external devices and peripherals.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Advanced packaging design for compact size and improved performance.

Minimum Supply Voltage: 1.14 V

Allows for flexibility in power input requirements.

Maximum Operating Temperature: 125 °C

Suitable for harsh operating environments such as automotive applications.

Minimum Operating Temperature: -40 °C

Operational reliability in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Durable finish for long-term reliability and corrosion resistance.

ADC Channels: YES

Enables analog input functionality for sensor interfacing and data acquisition.

DMA Channels: YES

Enhanced data transfer capabilities for efficient processing of high-speed data streams.

Technical Specifications

Microcontrollers F28388DZWTSR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of I/O Lines:

169

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

346112

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(3), SCI(4), SPI(4), SSI, UART, USB

Peripherals:

DMA(44), PWM(32), TEMPERATURE SENSOR, TIMER(9), WDT(5)

Analog To Digital Convertors:

24-Ch 16-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

F28388DZWTSR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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