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EP610JI-40

Texas Instruments

EP610JI-40 by Texas Instruments

EP610JI-40 by Texas Instruments is a CMOS UV PLD with 40 ns propagation delay, 20 inputs, and 16 I/O lines. It is used in PAL-type architecture applications requiring macrocell output function and operates b/w -40 to 85 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,710 parts In-Stock

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Digiode

USA . 4,820 parts In-Stock

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4,820

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Native Components

USA . 150 parts In-Stock

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$1.099

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$1.099

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Northwest PG Solutions

USA . 3,244 parts In-Stock

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$1.209

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One Stop Electronics

USA . 2,185 parts In-Stock

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$15.000

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AZTECH Wire

Italy . 190 parts In-Stock

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Semicontronic

India . 935 parts In-Stock

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$21.000

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$20.475

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$20.370

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935

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MARBEL Systems

Belgium . 3,738 parts In-Stock

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$42.740

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$41.031

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Texas Native Microelectronics

USA . 2,000 parts In-Stock

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$49.127

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$43.232

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Kenton Components

USA . 5,456 parts In-Stock

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$58.952

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$51.878

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Qasali Group International

UK . 10 parts In-Stock

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$132.643

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Parana Technologies

USA . 2,199 parts In-Stock

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DigiPath Technology Company

USA . 1,633 parts In-Stock

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IDEA Electronic Components Group

UK . 947 parts In-Stock

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$160.009

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ChromeModa Solutions

Germany . 684 parts In-Stock

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Supply Digital

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Corphita

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Corohmni

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Overview

Discover the EP610JI-40 by Texas Instruments, a cutting-edge Programmable Logic Device (PLD) that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this PLD is designed to meet the high demands of industrial applications with its advanced CMOS technology and fast propagation delay of 40ns. Perfect for a wide range of applications, this versatile chip carrier package features 160 product terms and 16 I/O lines, providing customers with flexibility and efficiency in their designs. Trust Texas Instruments for superior performance and innovation with the EP610JI-40.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability to the product, ensuring long-term performance in various environmental conditions.

Propagation Delay: 40 ns

Low propagation delay allows for fast processing and response times, making this PLD suitable for time-sensitive applications.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

No. of Inputs: 20

Having a higher number of inputs allows for more flexibility in designing complex logic circuits with multiple input signals.

Output Function: MACROCELL

The use of macrocells provides configurable logic functions, enabling customization and tailoring of the PLD to specific application requirements.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this PLD can function effectively in both extreme cold and hot conditions, enhancing its versatility.

Technical Specifications

Programmable Logic Devices (PLD) EP610JI-40 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

4 Dedicated Inputs, 16 I/O

No. of Outputs:

16

Output Function:

Macrocell

No. of Inputs:

20

No. of Product Terms:

160

No. of Dedicated Inputs:

4

No. of I/O Lines:

16

Propagation Delay:

40 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Zero Standby Function; 16 Macrocells With Configurable I/O

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-CQCC-J28

Qualified:

No

Trade Compliance

EP610JI-40 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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