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EP610LC-25

Texas Instruments

EP610LC-25 by Texas Instruments

EP610LC-25 by Texas Instruments is a CMOS PAL-TYPE PLD with 27ns propagation delay, 160 product terms, and 40MHz max clock frequency. Ideal for applications requiring high-speed logic operations in commercial temperature environments.

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Vyrian

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Manoshevitz Elec. Sales

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ACDS - Activité Composants Distribution Service

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LIBRA Elektronik GmbH

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Atlantic Semiconductor

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Mil-Aero Solutions, Inc.

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Corel Iberica Componentes, S.L.

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Inventory MP

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Legend Electronics Inc.

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GES GmbH

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Resion

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Digital Electronic Gebert Verwaltungs UG

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Native Components

USA . 1,303 parts In-Stock

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Northwest PG Solutions

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AZTECH Wire

Italy . 601 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 936 parts In-Stock

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Andel Nordic

Denmark . 1,545 parts In-Stock

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Modulus Dynamics

Lithuania . 789 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 1,554 parts In-Stock

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ChromeModa Solutions

Germany . 4,966 parts In-Stock

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IDEA Electronic Components Group

UK . 1,272 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 1,176 parts In-Stock

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Qasali Group International

UK . 100 parts In-Stock

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Alle Elektronik GmbH

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Glotronic Ltd.

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Corphita

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Supply Digital

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Metaverse IC Inc.

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A-Z Elektronik GmbH

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MARBEL Systems

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Speed Components Ltd (Excess)

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Assy Fe

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ChipstoGo Electronic ltd

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Perfect Parts

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Overview

Unlock the power of programmable logic devices with the EP610LC-25 by Texas Instruments. Crafted with precision and expertise, this PLD offers unmatched quality and reliability. Perfect for a variety of applications, from industrial automation to consumer electronics, this versatile device provides endless possibilities. With fast propagation delay and a wide supply voltage range, the EP610LC-25 delivers exceptional performance. Trust Texas Instruments to bring you cutting-edge technology that is sure to elevate your projects to new heights. Elevate your designs with the EP610LC-25 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good durability and protection for the internal components of the PLD.

Propagation Delay: 27 ns

With a propagation delay of only 27 ns, this PLD offers fast signal processing and high performance capabilities.

Technology Used: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making this PLD energy efficient and reliable.

No. of Inputs: 20

Having 20 inputs allows for versatile input configurations and enables the PLD to handle complex logic functions effectively.

Output Function: MACROCELL

The use of macrocells in the output function provides enhanced flexibility and programmability in designing complex logic functions.

Maximum Clock Frequency: 40 MHz

With a maximum clock frequency of 40 MHz, this PLD can handle high-speed operations and real-time processing efficiently.

No. of Outputs: 16

Having 16 outputs allows for multiple output signals to be generated simultaneously, increasing the versatility of the PLD.

Technical Specifications

Programmable Logic Devices (PLD) EP610LC-25 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

4 Dedicated Inputs, 16 I/O

No. of Outputs:

16

Output Function:

Macrocell

No. of Inputs:

20

No. of Product Terms:

160

No. of Dedicated Inputs:

4

No. of I/O Lines:

16

Maximum Clock Frequency:

40 MHz

Propagation Delay:

27 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Zero Standby Function; 16 Macrocells With Configurable I/O

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J28

Qualified:

No

Trade Compliance

EP610LC-25 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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