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EP610JC-30

Texas Instruments

EP610JC-30 by Texas Instruments

EP610JC-30 by Texas Instruments is a CMOS UV PLD with 32ns propagation delay, 160 product terms, and 33.3MHz clock frequency. Ideal for PAL-type applications requiring 20 inputs, 16 I/O lines, and macrocell output function in commercial temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,052 parts In-Stock

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8,052

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Digiode

USA . 3,226 parts In-Stock

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3,226

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Digital Electronic Gebert Verwaltungs UG

Germany . 43 parts In-Stock

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43

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Native Components

USA . 1,707 parts In-Stock

1+ parts

$0.306

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-

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$0.294

1,707

$0.306

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-

$0.294

Semicontronic

India . 1,191 parts In-Stock

1+ parts

$11.000

100+ parts

$10.725

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$10.670

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1,191

$11.000

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$10.670

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AZTECH Wire

Italy . 493 parts In-Stock

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$14.771

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$14.771

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One Stop Electronics

USA . 983 parts In-Stock

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$32.000

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983

$32.000

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MARBEL Systems

Belgium . 5,525 parts In-Stock

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$57.621

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$55.316

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$57.621

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Texas Native Microelectronics

USA . 500 parts In-Stock

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$66.231

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$63.582

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$61.595

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$66.231

$63.582

$61.595

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Kenton Components

USA . 4,593 parts In-Stock

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$79.477

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$69.940

4,593

$79.477

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$69.940

Modulus Dynamics

Lithuania . 554 parts In-Stock

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$87.112

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$87.112

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$87.112

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554

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Parana Technologies

USA . 1,293 parts In-Stock

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$137.662

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$12,783.971

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$123.895

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$12,783.971

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DigiPath Technology Company

USA . 241 parts In-Stock

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$151.582

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$151.582

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ChromeModa Solutions

Germany . 3,962 parts In-Stock

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$154.676

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$126.834

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$126.834

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IDEA Electronic Components Group

UK . 877 parts In-Stock

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$154.676

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$146.942

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$139.208

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877

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Corphita

USA . 4,613 parts In-Stock

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Northwest PG Solutions

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Supply Digital

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Qasali Group International

UK . 295 parts In-Stock

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$171.671

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$157.365

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Kepictronics

USA . 162 parts In-Stock

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Corohmni

South Africa . 147 parts In-Stock

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A-Plus Industry Inc.

USA . 5 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the EP610JC-30 from Texas Instruments. As a leader in the industry, Texas Instruments delivers unmatched quality and reliability. The EP610JC-30 falls under the category of Programmable Logic Devices, offering a versatile solution for a wide range of applications. With fast propagation delay, high clock frequency, and numerous I/O lines, this UV PLD chip carrier is designed to meet your needs efficiently. Experience seamless integration and enhanced performance with the EP610JC-30, setting new standards in programmable IC technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability for the PLD, making it suitable for rugged environments.

Propagation Delay: 32 ns

Fast propagation delay allows for efficient processing of signals and data within the PLD.

Surface Mount: YES

Surface mount capability simplifies PCB assembly and integration of the PLD into electronic systems.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the PLD energy-efficient and reliable.

No. of Inputs: 20

20 inputs provide sufficient flexibility and versatility for input signal processing and logic operations.

Nominal Supply Voltage (V): 5

Stable supply voltage of 5V ensures consistent performance of the PLD.

Output Function: MACROCELL

The presence of macrocells enables the PLD to perform complex logic functions, increasing its versatility in circuit design.

Maximum Clock Frequency: 33.3 MHz

High clock frequency allows for fast processing and execution of logic operations in real-time applications.

Technical Specifications

Programmable Logic Devices (PLD) EP610JC-30 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

4 Dedicated Inputs, 16 I/O

No. of Outputs:

16

Output Function:

Macrocell

No. of Inputs:

20

No. of Product Terms:

160

No. of Dedicated Inputs:

4

No. of I/O Lines:

16

Maximum Clock Frequency:

33.3 MHz

Propagation Delay:

32 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Zero Standby Function; 16 Macrocells With Configurable I/O

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-CQCC-J28

Qualified:

No

Trade Compliance

EP610JC-30 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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