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EP610JC-25

Texas Instruments

EP610JC-25 by Texas Instruments

EP610JC-25 by Texas Instruments is a CMOS UV PLD with 27 ns propagation delay, 160 product terms, and 40 MHz max clock frequency. Ideal for PAL-type applications requiring 4 dedicated inputs, 16 I/O lines in a ceramic chip carrier package. Operating temp range: 0-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 3,567 parts In-Stock

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Digiode

USA . 3,553 parts In-Stock

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Chip Stock

USA . 1,249 parts In-Stock

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ComSIT Distribution GmbH

Germany . 40 parts In-Stock

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Connector Distribution Corp

USA . 15 parts In-Stock

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Right Parts Inc.

USA . 15 parts In-Stock

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AZTECH Wire

Italy . 440 parts In-Stock

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$6.558

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One Stop Electronics

USA . 1,970 parts In-Stock

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$19.000

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Semicontronic

India . 831 parts In-Stock

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$28.000

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$27.300

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$27.160

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831

$28.000

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Parana Technologies

USA . 1,027 parts In-Stock

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$62.772

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$5,829.304

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$56.495

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DigiPath Technology Company

USA . 131 parts In-Stock

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$69.119

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ChromeModa Solutions

Germany . 4,868 parts In-Stock

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$70.530

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$57.835

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IDEA Electronic Components Group

UK . 373 parts In-Stock

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$67.004

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$63.477

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Modulus Dynamics

Lithuania . 1,717 parts In-Stock

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Texas Native Microelectronics

USA . 490 parts In-Stock

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$147.924

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$142.007

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$137.569

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$130.173

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Kenton Components

USA . 9,199 parts In-Stock

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$177.509

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$170.408

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$165.083

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$156.208

Qasali Group International

UK . 1,000 parts In-Stock

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$399.395

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Supply Digital

USA . 1,782 parts In-Stock

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Corphita

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Northwest PG Solutions

USA . 1,504 parts In-Stock

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Native Components

USA . 614 parts In-Stock

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Corohmni

South Africa . 344 parts In-Stock

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MARBEL Systems

Belgium . 50 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the EP610JC-25 by Texas Instruments. Crafted with precision and expertise, this Programmable Logic Device offers unparalleled performance for a wide range of applications. From enhancing system functionality to optimizing processes, this PLD is designed to meet your specific needs. With its advanced features and reliable construction, the EP610JC-25 delivers exceptional value and benefits to customers looking for top-tier quality and efficiency. Experience innovation like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments.

Propagation Delay: 27 ns

Low propagation delay allows for fast signal processing and high performance.

Maximum Supply Voltage: 5.25 V

Higher supply voltage tolerance provides flexibility in power supply options.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 20

Having a sufficient number of inputs allows for versatile functionality and design flexibility.

Package Shape: SQUARE

Square package shape is compact and space-saving, ideal for applications with limited space.

Architecture: PAL-TYPE

PAL-type architecture offers programmable logic capabilities for customization.

No. of Outputs: 16

Having multiple outputs facilitates driving multiple components or signals, increasing functionality.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for rapid processing and responsiveness.

Technical Specifications

Programmable Logic Devices (PLD) EP610JC-25 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

4 Dedicated Inputs, 16 I/O

No. of Outputs:

16

Output Function:

Macrocell

No. of Inputs:

20

No. of Product Terms:

160

No. of Dedicated Inputs:

4

No. of I/O Lines:

16

Maximum Clock Frequency:

40 MHz

Propagation Delay:

27 ns

Technology:

CMOS

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Zero Standby Function; 16 Macrocells With Configurable I/O

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-CQCC-J28

Qualified:

No

Trade Compliance

EP610JC-25 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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