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DS32ELX0421SQ/NOPB

Texas Instruments

DS32ELX0421SQ/NOPB by Texas Instruments

DS32ELX0421SQ/NOPB by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at -40 to 85°C. It has a supply voltage range of 3.135V to 3.465V and supports EIA-644; TIA-644 interface standard. Ideal for industrial applications requiring differential outputs in compact spaces.

Median Price

$5.710

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 901 parts In-Stock

1+ parts

-

100+ parts

$4.940

1k+ parts

$4.420

10k+ parts

$4.160

901

-

$4.940

$4.420

$4.160

DigiKey

USA . 901 parts In-Stock

1+ parts

-

100+ parts

$5.710

1k+ parts

-

10k+ parts

-

901

-

$5.710

-

-

Verical

USA . 901 parts In-Stock

1+ parts

-

100+ parts

$6.175

1k+ parts

$5.525

10k+ parts

$5.200

901

-

$6.175

$5.525

$5.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,905 parts In-Stock

1+ parts

$5.216

100+ parts

-

1k+ parts

-

10k+ parts

-

3,905

$5.216

-

-

-

Vyrian

USA . 7,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,100

-

-

-

-

DigiKey Marketplace

USA . 901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

901

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,752 parts In-Stock

1+ parts

$4.941

100+ parts

-

1k+ parts

-

10k+ parts

-

4,752

$4.941

-

-

-

Parana Technologies

USA . 417 parts In-Stock

1+ parts

$8.832

100+ parts

-

1k+ parts

$9.518

10k+ parts

-

417

$8.832

-

$9.518

-

DigiPath Technology Company

USA . 1,850 parts In-Stock

1+ parts

$9.726

100+ parts

$8.947

1k+ parts

-

10k+ parts

-

1,850

$9.726

$8.947

-

-

ChromeModa Solutions

Germany . 5,681 parts In-Stock

1+ parts

$9.924

100+ parts

$8.138

1k+ parts

-

10k+ parts

-

5,681

$9.924

$8.138

-

-

IDEA Electronic Components Group

UK . 1,376 parts In-Stock

1+ parts

$9.924

100+ parts

$9.428

1k+ parts

$8.932

10k+ parts

-

1,376

$9.924

$9.428

$8.932

-

Native Components

USA . 852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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852

-

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Northwest PG Solutions

USA . 653 parts In-Stock

1+ parts

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653

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Microchip USA

USA . 386 parts In-Stock

1+ parts

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386

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Overview

Enhance your electronic systems with the DS32ELX0421SQ/NOPB by Texas Instruments, a top-tier manufacturer known for its quality and reliability. As a leading product in the Line Drivers & Receivers category, this surface-mount device offers seamless integration and impressive performance. With a wide range of applications, from industrial to automotive, this chip carrier package provides value through its high supply voltage tolerance, differential output, and low power consumption. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and elevates your designs to new heights.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on the surface of a PCB, making it convenient for integration into electronic designs.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage allows for reliable operation within a wide range of power supply voltages.

No. of Functions: 2

Having multiple functions in a single package can help save space on the PCB and simplify the overall design.

Package Shape: SQUARE

The square package shape can provide a compact footprint, ideal for applications where space is limited.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages offers flexibility in designing and adapting to different system requirements.

No. of Terminals: 48

Having 48 terminals allows for a high level of connectivity and compatibility with various electronic components and systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer versatility in mounting options, thermal management, and space-saving capabilities.

Minimum Supply Voltage: 3.135 V

The low minimum supply voltage ensures proper functionality even in scenarios where power supply fluctuations occur.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures operational stability even in cold environments.

Technical Specifications

Line Drivers & Receivers DS32ELX0421SQ/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

152 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DS32ELX0421SQ/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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