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DS32EL0124SQE

Texas Instruments

DS32EL0124SQE by Texas Instruments

DS32EL0124SQE by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at -40 to 85 °C. It has a max supply voltage of 3.465 V and min of 2.375 V, suitable for industrial applications requiring differential output in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,943 parts In-Stock

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7,943

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Anansix

USA . 950 parts In-Stock

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950

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Digiode

USA . 921 parts In-Stock

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921

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Distributors (Availability)

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Native Components

USA . 3 parts In-Stock

1+ parts

$0.957

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3

$0.957

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Northwest PG Solutions

USA . 1,286 parts In-Stock

1+ parts

$1.052

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1,286

$1.052

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AZTECH Wire

Italy . 651 parts In-Stock

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$5.566

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651

$5.566

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Parana Technologies

USA . 1,849 parts In-Stock

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$9.267

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$9.900

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1,849

$9.267

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$9.900

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DigiPath Technology Company

USA . 916 parts In-Stock

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$10.204

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916

$10.204

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ChromeModa Solutions

Germany . 6,936 parts In-Stock

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$10.412

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$8.538

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6,936

$10.412

$8.538

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IDEA Electronic Components Group

UK . 1,076 parts In-Stock

1+ parts

$10.412

100+ parts

$9.891

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$9.371

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1,076

$10.412

$9.891

$9.371

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One Stop Electronics

USA . 1,645 parts In-Stock

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$18.500

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$18.500

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Lixinc

USA . 18,911 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 4,815 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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Corphita

USA . 1,954 parts In-Stock

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1,954

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Overview

Elevate your electronic designs with the DS32EL0124SQE from Texas Instruments, a leading manufacturer known for top-quality components. As part of the Line Drivers & Receivers category, this versatile chip boasts a multitude of applications, offering reliability and performance that is second to none. With features like differential output and a wide operating temperature range, this product provides customers with unmatched value and benefits. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to mount on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 2.625 V

Ideal for low power applications and helps in achieving energy efficiency.

No. of Functions: 2

Provides multiple functions in a single package, reducing the need for additional components.

Package Shape: SQUARE

Optimal shape for efficient use of board space and heat dissipation.

Maximum Supply Voltage-1: 3.465 V

Allows for flexibility in power supply options and compatibility with higher voltages.

No. of Terminals: 48

Offers a high level of connectivity and versatility in circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of package styles ensures effective heat dissipation and compact size.

Minimum Supply Voltage-1: 3.135 V

Provides a range of supply voltages for different operating conditions and power requirements.

Minimum Supply Voltage: 2.375 V

Suitable for low voltage applications and helps in minimizing power consumption.

Maximum Operating Temperature: 85 °C

Allows operation in high temperature environments, ensuring reliability and longevity.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: TIN LEAD

Provides good conductivity and solderability for reliable connections.

Terminal Position: QUAD

Quad terminal position enables easy and secure connections in the circuit.

Maximum Seated Height: 0.8 mm

Low profile design for compact and space-saving installations.

Width: 7 mm

Optimal width for fitting into standard size PCB layouts.

Receiver No. of Bits: 2

Enables transmission and reception of data in 2-bit format, suitable for simple communication protocols.

Differential Output: YES

Differential output helps in reducing noise and interference in signal transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process within specified time limits.

Peak Reflow Temperature °C: 235

High temperature tolerance during soldering process for reliable and durable connections.

Length: 7 mm

Optimal length to fit into compact electronic devices or PCB layouts.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions, ensuring robust performance.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations and RoHS standards.

Nominal Supply Voltage: 2.5 V

Ideal voltage for normal operation and efficient power consumption.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density connections in compact electronic devices.

Nominal Supply Voltage-1: 3.3 V

Alternate supply voltage option for different power requirements and operational needs.

Driver No. of Bits: 2

2-bit driver enables control and transmission of signals with multiple binary states.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level for safe handling and storage in various environments.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface for bidirectional communication between different systems or devices.

Technical Specifications

Line Drivers & Receivers DS32EL0124SQE attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Receiver No. of Bits:

2

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage-1:

3.465 V

Minimum Supply Voltage-1:

3.135 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DS32EL0124SQE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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