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DS32EL0124SQX/NOPB

Texas Instruments

DS32EL0124SQX/NOPB by Texas Instruments

DS32EL0124SQX/NOPB by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at -40 to 85°C. It features differential output, EIA-644 interface standard, and quad terminal position. Ideal for industrial applications requiring high-speed data transmission in tight spaces.

Median Price

$7.320

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,095 parts In-Stock

1+ parts

$7.402

100+ parts

$6.035

1k+ parts

$4.023

10k+ parts

-

8,095

$7.402

$6.035

$4.023

-

Rochester

USA . 21,600 parts In-Stock

1+ parts

-

100+ parts

$5.790

1k+ parts

$5.180

10k+ parts

$4.870

21,600

-

$5.790

$5.180

$4.870

DigiKey

USA . 21,600 parts In-Stock

1+ parts

-

100+ parts

$7.610

1k+ parts

-

10k+ parts

-

21,600

-

$7.610

-

-

Verical

USA . 21,600 parts In-Stock

1+ parts

-

100+ parts

$7.237

1k+ parts

$6.475

10k+ parts

$6.088

21,600

-

$7.237

$6.475

$6.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,327 parts In-Stock

1+ parts

$5.310

100+ parts

-

1k+ parts

-

10k+ parts

-

3,327

$5.310

-

-

-

Vyrian

USA . 3,632 parts In-Stock

1+ parts

$5.590

100+ parts

-

1k+ parts

-

10k+ parts

-

3,632

$5.590

-

-

-

DigiKey Marketplace

USA . 21,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 346 parts In-Stock

1+ parts

$0.353

100+ parts

-

1k+ parts

-

10k+ parts

$0.339

346

$0.353

-

-

$0.339

Northwest PG Solutions

USA . 670 parts In-Stock

1+ parts

$0.388

100+ parts

-

1k+ parts

-

10k+ parts

$0.342

670

$0.388

-

-

$0.342

Corphita

USA . 1,190 parts In-Stock

1+ parts

$5.031

100+ parts

-

1k+ parts

-

10k+ parts

-

1,190

$5.031

-

-

-

Parana Technologies

USA . 1,356 parts In-Stock

1+ parts

$7.052

100+ parts

-

1k+ parts

$7.591

10k+ parts

-

1,356

$7.052

-

$7.591

-

ChromeModa Solutions

Germany . 2,807 parts In-Stock

1+ parts

$7.924

100+ parts

$6.498

1k+ parts

-

10k+ parts

-

2,807

$7.924

$6.498

-

-

IDEA Electronic Components Group

UK . 96 parts In-Stock

1+ parts

$7.924

100+ parts

-

1k+ parts

$7.132

10k+ parts

-

96

$7.924

-

$7.132

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A-Z Elektronik GmbH

Germany . 7,002 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,002

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-

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Alle Elektronik GmbH

Germany . 4,668 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,668

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-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

-

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Kepictronics

USA . 825 parts In-Stock

1+ parts

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100+ parts

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825

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-

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DigiPath Technology Company

USA . 240 parts In-Stock

1+ parts

-

100+ parts

$7.144

1k+ parts

-

10k+ parts

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240

-

$7.144

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-

Overview

Discover unparalleled performance and reliability with the DS32EL0124SQX/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line line drivers & receivers that are essential for a wide range of applications. With a focus on quality and innovation, this product offers customers unmatched value, benefits, and advantages. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the DS32EL0124SQX/NOPB and experience the difference for yourself.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 2.625 V

Provides a safe voltage range for the device, ensuring reliable performance without risk of damage.

No. of Functions: 2

Offers dual functionality in a single package, increasing efficiency and versatility in circuit design.

Package Shape: SQUARE

Square shape allows for uniform placement and alignment on the PCB, aiding in assembly and reducing potential errors.

Maximum Supply Voltage-1: 3.465 V

Provides a wider voltage range for compatibility with different systems and applications.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options to accommodate various voltage requirements in different circuits.

No. of Terminals: 48

Offers ample connectivity options for interfacing with other components and devices in the circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles provide flexibility in packaging and integration, catering to different design constraints and requirements.

Minimum Supply Voltage-1: 3.135 V

Ensures stable operation even at lower supply voltages, enhancing the device's reliability in various conditions.

Minimum Supply Voltage: 2.375 V

Operates efficiently at low supply voltages, making it suitable for power-sensitive applications.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, allowing reliable operation in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Functions reliably in low-temperature environments, ensuring consistent performance across a wide range of operating conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring stable connections and longevity.

Terminal Position: QUAD

Quad terminal layout facilitates easy PCB layout and routing, simplifying the design process and enhancing signal integrity.

Maximum Seated Height: 0.8 mm

Low profile design minimizes the overall height of the device, enabling compact and space-efficient circuit layouts.

Width: 7 mm

Compact width enables easy integration into tight spaces, contributing to efficient PCB design.

Maximum Output Low Current: 0.01 Amp

Low output current ensures energy efficiency and prevents excess power consumption.

Receiver No. of Bits: 2

Dual-bit receiver design allows for accurate signal reception and processing, enhancing overall communication reliability.

Differential Output: YES

Differential output enhances noise immunity and signal integrity, making it suitable for high-speed data transmission applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring robust solder connections during assembly.

Peak Reflow Temperature °C: 260

Solder reflow temperature tolerance enables reliable manufacturing processes and high-quality solder joints.

Length: 7 mm

Compact length allows for space-efficient placement on the PCB, contributing to optimal circuit layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating conditions typically encountered in industrial settings.

Maximum Receive Delay: 0 ns

Zero receive delay ensures minimal signal latency, making it suitable for real-time data transmission applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainability in manufacturing.

Interface Standard: EIA-644; TIA-644

Compliant with industry standards for interface communication, ensuring interoperability and compatibility with other devices.

Input Characteristics: DIFFERENTIAL

Differential input configuration enhances noise rejection and signal quality, improving overall system performance.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation within specified voltage limits.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling efficient use of PCB space and facilitating compact designs.

Nominal Supply Voltage-1: 3.3 V

Provides a standard nominal supply voltage option, ensuring compatibility with common power sources.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling and storage precautions to maintain product reliability.

Interface IC Type: LINE RECEIVER

Specifically designed as a line receiver, optimizing signal reception and compatibility with transmission lines in various applications.

Technical Specifications

Line Drivers & Receivers DS32EL0124SQX/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

.01 Amp

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage-1:

3.465 V

Minimum Supply Voltage-1:

3.135 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DS32EL0124SQX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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