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DS32EL0124SQ/NOPB

Texas Instruments

DS32EL0124SQ/NOPB by Texas Instruments

DS32EL0124SQ/NOPB by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at -40 to 85°C. It features a max supply voltage of 3.465V and differential output for EIA-644/TIA-644 interface standard applications in industrial settings.

Median Price

$8.711

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,862 parts In-Stock

1+ parts

$8.747

100+ parts

$7.131

1k+ parts

$4.754

10k+ parts

-

17,862

$8.747

$7.131

$4.754

-

Rochester

USA . 27,279 parts In-Stock

1+ parts

-

100+ parts

$6.940

1k+ parts

$6.210

10k+ parts

$5.840

27,279

-

$6.940

$6.210

$5.840

DigiKey

USA . 27,279 parts In-Stock

1+ parts

-

100+ parts

$9.130

1k+ parts

-

10k+ parts

-

27,279

-

$9.130

-

-

Verical

USA . 27,279 parts In-Stock

1+ parts

-

100+ parts

$8.675

1k+ parts

$7.763

10k+ parts

$7.300

27,279

-

$8.675

$7.763

$7.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,379 parts In-Stock

1+ parts

$6.270

100+ parts

-

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-

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3,379

$6.270

-

-

-

Vyrian

USA . 3,017 parts In-Stock

1+ parts

$6.600

100+ parts

-

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-

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3,017

$6.600

-

-

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Component Sense

UK . 1,571 parts In-Stock

1+ parts

-

100+ parts

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1,571

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 924 parts In-Stock

1+ parts

$5.940

100+ parts

-

1k+ parts

-

10k+ parts

-

924

$5.940

-

-

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Parana Technologies

USA . 1,947 parts In-Stock

1+ parts

$5.965

100+ parts

-

1k+ parts

$6.746

10k+ parts

-

1,947

$5.965

-

$6.746

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IDEA Electronic Components Group

UK . 2,377 parts In-Stock

1+ parts

$6.702

100+ parts

-

1k+ parts

$6.032

10k+ parts

-

2,377

$6.702

-

$6.032

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ChromeModa Solutions

Germany . 1,684 parts In-Stock

1+ parts

$6.702

100+ parts

$5.496

1k+ parts

-

10k+ parts

-

1,684

$6.702

$5.496

-

-

Native Components

USA . 472 parts In-Stock

1+ parts

$298.750

100+ parts

$292.775

1k+ parts

$289.788

10k+ parts

$286.800

472

$298.750

$292.775

$289.788

$286.800

Northwest PG Solutions

USA . 601 parts In-Stock

1+ parts

$328.625

100+ parts

-

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601

$328.625

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A-Z Elektronik GmbH

Germany . 5,543 parts In-Stock

1+ parts

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5,543

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Alle Elektronik GmbH

Germany . 3,695 parts In-Stock

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3,695

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

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2,700

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DigiPath Technology Company

USA . 610 parts In-Stock

1+ parts

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100+ parts

$6.043

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610

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$6.043

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Overview

Discover the power of Texas Instruments with the DS32EL0124SQ/NOPB line driver & receiver. This versatile chip offers reliability and quality, making it ideal for a wide range of applications. With a square package shape and differential output, this product provides high performance with a nominal supply voltage of 2.5V. Designed for industrial use, this interface IC type is ready to meet your needs. Trust Texas Instruments for cutting-edge technology that delivers value and innovation to customers.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on PCBs, saving time and space in the design.

Maximum Supply Voltage: 2.625 V

Ensures compatibility with a wide range of power supply voltages, making it versatile for different applications.

No. of Functions: 2

Provides multiple functions in a single component, reducing the need for additional parts and simplifying the circuit design.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, enabling dense component placement.

Maximum Supply Voltage-1: 3.465 V

Provides a higher supply voltage option for applications that require increased power handling capabilities.

Power Supplies (V): 2.5, 3.3

Supports multiple power supply options, giving flexibility to the designer based on their specific requirements.

No. of Terminals: 48

Has a high number of terminals for connecting to various signals and power sources, enhancing connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles provide options for different mounting and cooling needs, improving performance and efficiency.

Minimum Supply Voltage-1: 3.135 V

Provides a lower supply voltage option for applications that require lower power consumption or operation at lower voltages.

Minimum Supply Voltage: 2.375 V

Ensures compatibility with lower supply voltages, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications with harsh operating conditions.

Minimum Operating Temperature: -40 °C

Can operate at very low temperatures, making it suitable for use in extreme environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections and durability.

Terminal Position: QUAD

Quad terminal position allows for easy integration into the PCB layout, facilitating efficient signal routing and design.

Maximum Seated Height: 0.8 mm

Compact size with a low profile makes it suitable for applications with space constraints, enabling compact and slim designs.

Width: 7 mm

Narrow width allows for efficient use of board space and enables high-density mounting for increased functionality in a limited area.

Maximum Output Low Current: 0.01 Amp

Low current output capability helps in reducing power consumption and heat dissipation, improving energy efficiency.

Receiver No. of Bits: 2

Supports 2 bits of data transmission, suitable for applications that require simple data reception and processing.

Differential Output: YES

Differential output configuration provides high noise immunity and signal integrity, making it suitable for high-speed data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified time, ensuring reliable soldering during PCB assembly.

Peak Reflow Temperature °C: 260

Designed to withstand high peak reflow temperatures during soldering processes, ensuring robust and reliable solder joints.

Length: 7 mm

Compact length allows for space-efficient placement on the PCB, contributing to a streamlined and organized circuit layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh environmental conditions typically found in industrial settings.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time processing and transmission of data signals, critical for applications requiring high-speed communication.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and complies with regulations, making it a sustainable choice for electronic designs.

Interface Standard: EIA-644; TIA-644

Compliance with industry-standard interface protocols ensures compatibility and interoperability with various systems and devices.

Input Characteristics: DIFFERENTIAL

Differential input design provides superior noise rejection and signal integrity, essential for high-fidelity data transmission in noisy environments.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliable operation under normal operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact PCB layouts, ideal for space-constrained applications.

Nominal Supply Voltage-1: 3.3 V

Stable nominal supply voltage option provides flexibility in power requirements, catering to a variety of applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling to prevent damage.

Interface IC Type: LINE RECEIVER

Specifically designed as a line receiver IC for receiving and processing data signals, ensuring accurate and reliable data transmission.

Technical Specifications

Line Drivers & Receivers DS32EL0124SQ/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

.01 Amp

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage-1:

3.465 V

Minimum Supply Voltage-1:

3.135 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DS32EL0124SQ/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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