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DS32EL0124

Texas Instruments

DS32EL0124 by Texas Instruments

DS32EL0124 by Texas Instruments is a Line Receiver IC with 2 functions, operating at -40 to 85 °C. It has a supply voltage range of 2.375V to 3.465V and comes in a square package style suitable for industrial applications. With differential input characteristics, it offers reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,306 parts In-Stock

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Digiode

USA . 1,965 parts In-Stock

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1,965

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Anansix

USA . 598 parts In-Stock

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598

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Native Components

USA . 63 parts In-Stock

1+ parts

$0.072

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$0.069

63

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$0.069

Northwest PG Solutions

USA . 1,559 parts In-Stock

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$0.079

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$0.069

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$0.069

Parana Technologies

USA . 1,660 parts In-Stock

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$2.650

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$3.140

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$2.650

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$3.140

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DigiPath Technology Company

USA . 1,667 parts In-Stock

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$2.918

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$2.918

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ChromeModa Solutions

Germany . 6,179 parts In-Stock

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$2.978

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$2.442

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$2.978

$2.442

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IDEA Electronic Components Group

UK . 47 parts In-Stock

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$2.978

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$2.680

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47

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$2.680

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AZTECH Wire

Italy . 571 parts In-Stock

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$8.119

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One Stop Electronics

USA . 1,138 parts In-Stock

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$19.500

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Corphita

USA . 5,045 parts In-Stock

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Overview

Elevate your system's performance with the DS32EL0124 by Texas Instruments, a top-tier manufacturer known for delivering cutting-edge technology. This line driver and receiver offers exceptional quality and reliability, making it ideal for a wide range of applications. With its surface mount design and advanced features, this product provides unmatched value, benefits, and advantages to customers looking to optimize their systems. Upgrade to the DS32EL0124 today and experience the difference in performance and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 2.625 V

Supports a wide range of supply voltages, providing flexibility in different applications.

No. of Functions: 2

Allows for versatile functionality within a single component, reducing the need for multiple devices.

Package Shape: SQUARE

Square package shape can provide better thermal dissipation and easier handling during installation.

Maximum Supply Voltage-1: 3.465 V

Provides a higher supply voltage option for applications that require increased power handling capabilities.

No. of Terminals: 48

Offers a high number of terminals for connecting to various components and circuits, enhancing connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile design allows for efficient heat dissipation and compact size.

Minimum Supply Voltage-1: 3.135 V

Provides a lower supply voltage option for applications that require energy efficiency and lower power consumption.

Minimum Supply Voltage: 2.375 V

Supports a low minimum supply voltage, enabling operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, ensuring reliability in diverse conditions.

Minimum Operating Temperature: -40 °C

Maintains functionality at low temperatures, suitable for use in extreme cold environments.

Terminal Position: QUAD

Quad terminal position enhances ease of installation and connection, facilitating integration into circuit designs.

Maximum Seated Height: 0.8 mm

Low seated height allows for compact designs and reduced overall size of the product.

Width: 7 mm

Narrow width enables efficient space utilization on circuit boards, ideal for designs with limited space.

Receiver No. of Bits: 2

Two bits for the receiver offer basic signal processing capabilities, suitable for simple data transmission applications.

Length: 7 mm

Compact length allows for easy integration into tight spaces and small electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature range, making it suitable for harsh operating conditions.

Terminal Form: NO LEAD

No lead terminal form enhances reliability and minimizes risk of solder joint failure.

Input Characteristics: DIFFERENTIAL

Differential input characteristics offer improved noise immunity and signal integrity in transmission.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard voltage levels.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, maximizing connectivity options in a compact package.

Nominal Supply Voltage-1: 3.3 V

Higher nominal supply voltage option for applications that require increased power efficiency and performance.

Interface IC Type: LINE RECEIVER

Specialized interface IC type for effective signal reception and processing in line communication applications.

Technical Specifications

Line Drivers & Receivers DS32EL0124 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Receiver No. of Bits:

2

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage-1:

3.465 V

Minimum Supply Voltage-1:

3.135 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DS32EL0124 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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