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DS14185MWA

Texas Instruments

DS14185MWA by Texas Instruments

DS14185MWA by Texas Instruments is a Line Transceiver IC with 3 functions. It operates at 4.75-5.25 V and supports EIA-232-E; TIA-232-E interface standard. Ideal for commercial applications requiring fast data transmission with a max delay of 350 ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,157 parts In-Stock

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Digiode

USA . 4,955 parts In-Stock

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4,955

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Anansix

USA . 1,244 parts In-Stock

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1,244

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 206 parts In-Stock

1+ parts

$0.109

100+ parts

-

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-

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$0.105

206

$0.109

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$0.105

Northwest PG Solutions

USA . 1,276 parts In-Stock

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$0.120

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$0.106

1,276

$0.120

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$0.106

Parana Technologies

USA . 1,866 parts In-Stock

1+ parts

$2.790

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$3.275

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1,866

$2.790

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$3.275

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DigiPath Technology Company

USA . 1,551 parts In-Stock

1+ parts

$3.072

100+ parts

$2.827

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1,551

$3.072

$2.827

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ChromeModa Solutions

Germany . 4,331 parts In-Stock

1+ parts

$3.135

100+ parts

$2.571

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4,331

$3.135

$2.571

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IDEA Electronic Components Group

UK . 2,015 parts In-Stock

1+ parts

$3.135

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$2.822

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2,015

$3.135

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$2.822

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AZTECH Wire

Italy . 834 parts In-Stock

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$10.585

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834

$10.585

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One Stop Electronics

USA . 1,206 parts In-Stock

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$23.500

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$23.500

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Corphita

USA . 2,341 parts In-Stock

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Overview

Experience superior quality and reliability with the DS14185MWA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers innovative solutions for Line Drivers & Receivers, making it the perfect choice for your application needs. With a maximum supply voltage of 5.25V and fast transmit and receive delays, this product offers exceptional value and performance. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and enhances your projects. Choose the DS14185MWA for unmatched benefits and advantages in your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design makes it easy to integrate into compact electronic devices.

Maximum Supply Voltage: 5.25 V

Allows for a wide range of input power options, providing flexibility in usage.

No. of Functions: 3

Offers multiple functions in a single component, reducing the need for additional circuitry.

Maximum Transmit Delay: 350 ns

Provides fast transmission speeds, crucial for real-time data transfer applications.

Maximum Supply Voltage-1: 13.2 V

Supports higher voltage requirements, suitable for industrial applications.

Package Style (Meter): UNCASED CHIP

Compact package design for space-constrained applications.

Minimum Supply Voltage-1: 9 V

Able to operate at lower voltage levels, conserving power.

Minimum Supply Voltage: 4.75 V

Can function with low supply voltage, suitable for battery-powered devices.

Maximum Operating Temperature: 70 °C

Operational in a wide range of temperatures, making it versatile for various environments.

Minimum Operating Temperature: 0 °C

Can operate at freezing temperatures, ideal for cold storage or outdoor use.

Terminal Position: UPPER

Convenient terminal positioning for easy installation and maintenance.

Receiver No. of Bits: 5

High-resolution receiver function for accurate data reception.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications with moderate temperature ranges.

Maximum Receive Delay: 350 ns

Low receive delay ensures quick response to incoming signals.

Technology: BIPOLAR

Bipolar technology offers stable performance and reliability.

Terminal Form: NO LEAD

Lead-free terminal design for environmental compatibility and ease of disposal.

Interface Standard: EIA-232-E; TIA-232-E

Compliant with industry communication standards for seamless integration with existing systems.

Input Characteristics: STANDARD

Standard input characteristics for compatibility with a wide range of devices.

Nominal Supply Voltage: 5 V

Stable operating voltage for consistent performance.

Nominal Negative Supply Voltage: -12 V

Supports negative voltage requirements for balanced signal processing.

Nominal Supply Voltage-1: 12 V

Provides additional voltage option for specific applications.

Driver No. of Bits: 3

Efficient driver function with three bits for accurate signal transmission.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface for seamless communication between devices.

Technical Specifications

Line Drivers & Receivers DS14185MWA attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

3

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-232-E; TIA-232-E

JESD-30 Code:

X-XUUC-N

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

3

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Receive Delay:

350 ns

Receiver No. of Bits:

5

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

13.2 V

Minimum Supply Voltage-1:

9 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Transmit Delay:

350 ns

Trade Compliance

DS14185MWA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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