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DS14185WMX

Texas Instruments

DS14185WMX by Texas Instruments

DS14185WMX by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 5V. It features a max transmit delay of 350ns and max receive delay of 100ns. Ideal for EIA-232-E/TIA-232-E interfaces in commercial temperature grades.

Median Price

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Lifecycle Status

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14

In-Stock Inventory

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Digiode

USA . 4,157 parts In-Stock

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Vyrian

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Anansix

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Semi Source

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Odi Ramu Company

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Microfarads

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LWI Electronics Inc

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Prism Electronics

USA . 1,667 parts In-Stock

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R&J Components

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Bristol Electronics

USA . 1,065 parts In-Stock

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MRC Electronics

USA . 1,000 parts In-Stock

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Lantek

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ACDS - Activité Composants Distribution Service

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Inventory MP

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Native Components

USA . 790 parts In-Stock

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$0.118

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Northwest PG Solutions

USA . 679 parts In-Stock

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$0.130

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AZTECH Wire

Italy . 696 parts In-Stock

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$8.265

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Parana Technologies

USA . 573 parts In-Stock

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$9.124

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DigiPath Technology Company

USA . 1,685 parts In-Stock

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$10.047

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$9.243

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ChromeModa Solutions

Germany . 6,242 parts In-Stock

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IDEA Electronic Components Group

UK . 1,841 parts In-Stock

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One Stop Electronics

USA . 330 parts In-Stock

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Component Stockers USA

USA . 643 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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GreenTree Electronics

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Authorized Procurement Solutions

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Metaverse IC Inc.

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Alle Elektronik GmbH

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Perfect Parts

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Corphita

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Cyclops Electronics Ltd (Excess)

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Kepictronics

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Microchip USA

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Overview

Experience the superior quality and reliability of Texas Instruments with the DS14185WMX Line Drivers & Receivers. This versatile product offers 3 functions in a compact package, making it ideal for a wide range of applications. With fast transmit and receive delays, low input current, and high output current, this product provides exceptional performance and value. Trust in Texas Instruments to deliver cutting-edge technology that meets your business needs. Elevate your projects with the DS14185WMX today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Being surface mountable, the product is easy to install and saves space on the PCB, making it suitable for compact designs.

No. of Functions: 3

With multiple functions integrated into one device, this product offers versatility and efficiency in handling different tasks.

Maximum Transmit Delay: 350 ns

The low transmit delay ensures fast and efficient data transmission, improving the overall performance of the system.

Power Supplies (V): 5,+-12

The wide range of power supply options allows for flexibility in system integration and compatibility with various power sources.

No. of Terminals: 20

The ample number of terminals provide easy connectivity and interface options, making it versatile for different applications.

Maximum High Level Input Current: 0.00001 Amp

The low input current requirement ensures efficient power consumption and helps in reducing heat dissipation, making the product energy-efficient.

Maximum Operating Temperature: 70 °C

The high operating temperature range ensures reliability and stability in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation even in cold environments, adding to the product's flexibility and durability.

Terminal Finish: TIN LEAD

The use of tin-lead terminal finish ensures good solderability and conductivity, enhancing the product's reliability and performance.

Maximum Output Low Current: 3.2 Amp

The high output current capability allows the product to drive demanding loads effectively, making it suitable for various high-power applications.

Receiver No. of Bits: 5

The 5-bit receiver provides sufficient data resolution for accurate signal reception and processing, enhancing the overall performance of the system.

Peak Reflow Temperature °C: 220

The high peak reflow temperature tolerance ensures the product can withstand harsh soldering processes, increasing its durability and reliability.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, the product is suitable for a wide range of indoor applications, offering reliability and consistent performance.

Technology: BIPOLAR

The bipolar technology used in the product ensures high-speed data transmission and reliable operation, making it ideal for demanding applications.

Nominal Supply Voltage: 5 V

The 5V supply voltage compatibility makes the product easy to integrate into existing systems and ensures stable operation with common voltage sources.

Technical Specifications

Line Drivers & Receivers DS14185WMX attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-E; TIA-232-E

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

12 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

220

Power Supplies (V):

5,+-12

Qualification:

Not Qualified

Maximum Receive Delay:

100 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Maximum Transmit Delay:

350 ns

Width:

7.5 mm

Trade Compliance

DS14185WMX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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