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DS14185WMX/NOPB

Texas Instruments

DS14185WMX/NOPB by Texas Instruments

LINE TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.972

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26,702 parts In-Stock

1+ parts

-

100+ parts

$0.954

1k+ parts

$0.792

10k+ parts

$0.706

26,702

-

$0.954

$0.792

$0.706

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.990

10k+ parts

$0.882

15,000

-

-

$0.990

$0.882

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,731 parts In-Stock

1+ parts

$0.741

100+ parts

-

1k+ parts

-

10k+ parts

-

1,731

$0.741

-

-

-

Vyrian

USA . 2,162 parts In-Stock

1+ parts

$0.780

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-

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-

2,162

$0.780

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Quantum Digital Technology

USA . 3,064 parts In-Stock

1+ parts

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3,064

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Sensible Micro Corp

USA . 2,785 parts In-Stock

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2,785

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Anansix

USA . 651 parts In-Stock

1+ parts

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651

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Univa Technologies Pte. Ltd

Singapore . 532 parts In-Stock

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532

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 560 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

$0.159

560

$0.166

-

-

$0.159

Northwest PG Solutions

USA . 1,267 parts In-Stock

1+ parts

$0.182

100+ parts

-

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$0.161

1,267

$0.182

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$0.161

Ampacity Inc.

Singapore . 15,917 parts In-Stock

1+ parts

$0.660

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15,917

$0.660

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Corphita

USA . 630 parts In-Stock

1+ parts

$0.702

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630

$0.702

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Parana Technologies

USA . 12 parts In-Stock

1+ parts

$10.815

100+ parts

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1k+ parts

$11.293

10k+ parts

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12

$10.815

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$11.293

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DigiPath Technology Company

USA . 2,093 parts In-Stock

1+ parts

$11.909

100+ parts

$10.956

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2,093

$11.909

$10.956

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IDEA Electronic Components Group

UK . 2,314 parts In-Stock

1+ parts

$12.152

100+ parts

$11.544

1k+ parts

$10.937

10k+ parts

-

2,314

$12.152

$11.544

$10.937

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ChromeModa Solutions

Germany . 1,883 parts In-Stock

1+ parts

$12.152

100+ parts

$9.965

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1,883

$12.152

$9.965

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QUARKTWIN TECHNOLOGY LTD

USA . 18,515 parts In-Stock

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CPlus Electronics

USA . 16,000 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Perfect Parts

USA . 3,258 parts In-Stock

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3,258

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Microchip USA

USA . 2,213 parts In-Stock

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2,213

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Univa Technologies Pte. Ltd (Excess)

Singapore . 532 parts In-Stock

1+ parts

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532

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Technical Specifications

Line Drivers & Receivers DS14185WMX/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-E; TIA-232-E

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

12 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,+-12

Qualification:

Not Qualified

Maximum Receive Delay:

100 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

350 ns

Width:

7.5 mm

Trade Compliance

DS14185WMX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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