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DRV601RTJTG4

Texas Instruments

DRV601RTJTG4 by Texas Instruments

DRV601RTJTG4 by Texas Instruments is a Line Driver with 2 functions, operating at 3.3V. It features a max supply voltage of 4.5V and operates in temperatures ranging from 0 to 70°C. Ideal for applications requiring high-speed signal transmission in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,496 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,496

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Digiode

USA . 964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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964

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 68 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

$2.816

10k+ parts

-

68

$2.318

-

$2.816

-

ChromeModa Solutions

Germany . 5,902 parts In-Stock

1+ parts

$2.605

100+ parts

$2.136

1k+ parts

-

10k+ parts

-

5,902

$2.605

$2.136

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IDEA Electronic Components Group

UK . 603 parts In-Stock

1+ parts

$2.605

100+ parts

-

1k+ parts

$2.344

10k+ parts

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603

$2.605

-

$2.344

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AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$6.152

100+ parts

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10k+ parts

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639

$6.152

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One Stop Electronics

USA . 473 parts In-Stock

1+ parts

$9.500

100+ parts

-

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10k+ parts

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473

$9.500

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Northwest PG Solutions

USA . 1,494 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.330

10k+ parts

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1,494

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-

$3.330

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Corphita

USA . 1,319 parts In-Stock

1+ parts

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100+ parts

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1,319

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DigiPath Technology Company

USA . 519 parts In-Stock

1+ parts

-

100+ parts

$2.349

1k+ parts

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519

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$2.349

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Native Components

USA . 224 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$3.296

10k+ parts

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224

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$3.296

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Overview

Discover the DRV601RTJTG4 by Texas Instruments, a top-quality line driver & receiver that delivers exceptional performance. Manufactured by Texas Instruments, this product offers reliability, precision, and innovation. Ideal for a wide range of applications, this device provides seamless communication and superior signal integrity. With its advanced features and durable build, the DRV601RTJTG4 ensures optimal functionality and long-term satisfaction. Upgrade your system today with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the internal components of the device, making it suitable for various environments.

Surface Mount: YES

Being surface-mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, increasing flexibility in application.

No. of Functions: 2

Having multiple functions in a single device simplifies circuit design and saves on component count, reducing overall system complexity.

Package Shape: SQUARE

The square package shape is space-efficient and facilitates easy placement on PCBs, optimizing board layout and design.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard voltage levels commonly used in electronic systems.

No. of Terminals: 20

Having 20 terminals allows for connection to multiple components or external devices, enabling versatile functionality and connectivity.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier and thin profile design enable efficient heat dissipation and compact integration, ideal for space-constrained applications.

Maximum High Level Input Current: 0.000001 Amp

The low maximum high-level input current minimizes power consumption and heat generation, improving overall energy efficiency.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for operation in low-power scenarios, making this product suitable for battery-powered devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can reliably operate in a wide range of environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures functionality even in cold environments, making this product suitable for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and connection to the PCB, enhancing overall reliability and solder joint strength.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a slim and compact profile, minimizing interference with neighboring components and improving overall board layout.

Width: 4 mm

The compact width of 4mm enables space-efficient placement on the circuit board, contributing to a streamlined and optimized design.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables efficient soldering and assembly, ensuring strong and durable connections.

Length: 4 mm

The length of 4mm contributes to the compact form factor of the device, making it suitable for space-constrained applications.

Minimum Out Swing: 6.15 V

The minimum output swing of 6.15V ensures high signal integrity and robust communication, making this product ideal for reliable data transmission.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product is suitable for standard operating conditions in commercial applications.

Maximum Receive Delay: 0 ns

The zero maximum receive delay ensures real-time data processing and minimal latency, making this product suitable for high-speed communication.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and assembly processes, reducing manufacturing complexities and improving assembly efficiency.

Input Characteristics: STANDARD

Having standard input characteristics ensures compatibility with a wide range of systems and devices, making this product versatile and easy to integrate.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures consistent and stable operation, making this product reliable in various operating conditions.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for fine-pitch connections, enabling high-density integration and compact PCB designs.

Moisture Sensitivity Level (MSL): 2

The MSL level 2 indicates that this product has moderate moisture sensitivity, making it suitable for standard manufacturing and storage conditions.

Interface IC Type: LINE DRIVER

As a line driver, this product is designed to boost and optimize signal transmission, ensuring reliable communication over long distances or in noisy environments.

Technical Specifications

Line Drivers & Receivers DRV601RTJTG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

1

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

6.15 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

DRV601RTJTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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