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DRV600RTJ

Texas Instruments

DRV600RTJ by Texas Instruments

DRV600RTJ by Texas Instruments is a Line Driver with 2 functions, operating at 1.8-4.5V, suitable for industrial applications. It features Differential Output, Differential Schmitt Trigger input characteristics, and operates in temperatures ranging from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,207 parts In-Stock

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Digiode

USA . 4,802 parts In-Stock

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4,802

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Prism Electronics

USA . 15 parts In-Stock

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15

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One Stop Electronics

USA . 1,187 parts In-Stock

1+ parts

$3.500

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1,187

$3.500

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AZTECH Wire

Italy . 426 parts In-Stock

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$6.470

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426

$6.470

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Parana Technologies

USA . 894 parts In-Stock

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$11.683

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$12.076

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894

$11.683

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$12.076

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ChromeModa Solutions

Germany . 4,798 parts In-Stock

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$13.127

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$10.764

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4,798

$13.127

$10.764

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IDEA Electronic Components Group

UK . 2,298 parts In-Stock

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$13.127

100+ parts

$12.471

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$11.814

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$13.127

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$11.814

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Native Components

USA . 493 parts In-Stock

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$133.659

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$128.312

493

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$128.312

Northwest PG Solutions

USA . 1,258 parts In-Stock

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$147.024

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Corphita

USA . 3,416 parts In-Stock

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DigiPath Technology Company

USA . 2,008 parts In-Stock

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$11.835

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2,008

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$11.835

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Overview

Upgrade your electronic projects with the DRV600RTJ by Texas Instruments, a top-of-the-line line driver and receiver that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this versatile chip carrier features differential output and operates in industrial-grade temperatures, making it perfect for a wide range of applications. With its compact square shape and nickel palladium gold terminal finish, the DRV600RTJ provides customers with a durable and efficient solution for their circuit needs. Experience the benefits of Texas Instruments' expertise and innovation with the DRV600RTJ – the ultimate choice for your electronic design projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making the product suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving in electronic circuit designs.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage gives flexibility in power requirements and compatibility with a wide range of systems.

No. of Functions: 2

Having 2 functions in one package adds efficiency and compactness to circuits, reducing the need for multiple components.

Package Shape: SQUARE

The square package shape allows for easier placement and alignment on circuit boards.

No. of Terminals: 20

With 20 terminals, the product offers versatility in connection options and signal routing.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term performance.

Width: 4 mm

The compact width of 4mm enables space-efficient designs and integration into tight spaces.

Differential Output: YES

Differential output facilitates noise reduction and improved signal quality in communication systems.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, ensuring stability and reliability in harsh operating conditions.

Technical Specifications

Line Drivers & Receivers DRV600RTJ attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

DRV600RTJ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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