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DRV3245AQPHPTQ1

Texas Instruments

DRV3245AQPHPTQ1 by Texas Instruments

Texas Instruments' DRV3245AQPHPTQ1 is a Motion Control IC with AEC-Q100 screening. It operates b/w -40 to 125 °C and supports Brushless DC Motor control. The 48-terminal package is flatpack, heat sink/slug, thin profile, fine pitch for automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,135 parts In-Stock

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Digiode

USA . 3,106 parts In-Stock

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3,106

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Distributors (Availability)

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Native Components

USA . 768 parts In-Stock

1+ parts

$1.641

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768

$1.641

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Northwest PG Solutions

USA . 2,098 parts In-Stock

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$1.805

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$1.805

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Ampacity Inc.

Singapore . 975 parts In-Stock

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$2.500

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975

$2.500

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One Stop Electronics

USA . 362 parts In-Stock

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$5.500

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362

$5.500

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Semicontronic

India . 202 parts In-Stock

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$6.500

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$6.338

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$6.305

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202

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 272 parts In-Stock

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$8.138

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272

$8.138

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Parana Technologies

USA . 920 parts In-Stock

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$9.568

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$10.166

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920

$9.568

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ChromeModa Solutions

Germany . 3,434 parts In-Stock

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$10.751

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$8.816

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$10.751

$8.816

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IDEA Electronic Components Group

UK . 1,841 parts In-Stock

1+ parts

$10.751

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$10.213

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$9.676

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$10.751

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$9.676

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Corphita

USA . 3,430 parts In-Stock

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DigiPath Technology Company

USA . 1,917 parts In-Stock

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$9.693

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Corohmni

South Africa . 140 parts In-Stock

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Overview

Enhance your motion control systems with the DRV3245AQPHPTQ1 from Texas Instruments, a leading manufacturer known for top-quality products. Ideal for automotive applications, this brushless DC motor controller offers reliability and precision in a compact package. With a wide operating temperature range, high voltage supply capabilities, and advanced features, this IC provides unmatched value and performance. Upgrade your designs with the DRV3245AQPHPTQ1 and experience the benefits of cutting-edge technology in motion control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, reducing assembly time and costs.

Screening Level: AEC-Q100

Indicates that the product meets stringent automotive quality standards, making it suitable for automotive applications where reliability is essential.

Package Shape: SQUARE

Square shape allows for easier integration into circuit board layouts and overall design flexibility.

No. of Terminals: 48

Provides ample connectivity options and flexibility for various system configurations.

Maximum Operating Temperature: 125 °C

Can operate reliably in high-temperature environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, ensuring functionality in a wide range of environmental conditions.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connection to the circuit board, reducing the risk of disconnection.

Width (mm): 7 mm

Compact width allows for space-saving installation, ideal for applications with tight board real estate.

Minimum Supply Voltage (Vsup): 4.4 V

Low minimum supply voltage requirement allows for energy-efficient operation and compatibility with a wide range of power sources.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliable performance in challenging automotive environments.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise and secure connections, essential for maintaining signal integrity in motion control applications.

Maximum Supply Voltage (Vsup): 45 V

High maximum supply voltage tolerance provides flexibility for use in systems with varying power requirements.

Technical Specifications

Motion Control ICs DRV3245AQPHPTQ1 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

45 V

Minimum Supply Voltage (Vsup):

4.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

DRV3245AQPHPTQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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