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DRV3203QPHPRQ1

Texas Instruments

DRV3203QPHPRQ1 by Texas Instruments

DRV3203QPHPRQ1 by Texas Instruments is a Motion Control IC with 48 terminals, operating voltage of 12V, and temp range of -40 to 125°C. Ideal for automotive applications, it features a flatpack package style and nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,857 parts In-Stock

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2,857

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Digiode

USA . 574 parts In-Stock

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574

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Distributors (Availability)

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Native Components

USA . 449 parts In-Stock

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$0.227

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-

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$0.218

449

$0.227

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$0.218

Northwest PG Solutions

USA . 415 parts In-Stock

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$0.250

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$0.220

415

$0.250

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$0.220

Ampacity Inc.

Singapore . 184 parts In-Stock

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$1.500

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$1.500

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Semicontronic

India . 1,196 parts In-Stock

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$4.500

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$4.388

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$4.365

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1,196

$4.500

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$4.365

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Parana Technologies

USA . 1,190 parts In-Stock

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$4.745

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$5.246

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1,190

$4.745

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$5.246

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DigiPath Technology Company

USA . 2,149 parts In-Stock

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$5.225

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$5.225

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ChromeModa Solutions

Germany . 827 parts In-Stock

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$5.332

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$4.372

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827

$5.332

$4.372

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IDEA Electronic Components Group

UK . 65 parts In-Stock

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$5.332

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$4.799

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65

$5.332

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$4.799

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AZTECH Wire

Italy . 604 parts In-Stock

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$5.625

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$5.625

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One Stop Electronics

USA . 985 parts In-Stock

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$6.500

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$6.500

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QUARKTWIN TECHNOLOGY LTD

USA . 16,817 parts In-Stock

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Corphita

USA . 2,468 parts In-Stock

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Corohmni

South Africa . 124 parts In-Stock

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Microchip USA

USA . 122 parts In-Stock

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Overview

Experience superior motion control with the DRV3203QPHPRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Motion Control ICs that are perfect for a wide range of applications. With a package body material made of PLASTIC/EPOXY and AEC-Q100 screening level, this product ensures reliability and durability. The DRV3203QPHPRQ1 offers customers unmatched value with its high performance and efficiency. Elevate your projects with this BRUSHLESS DC MOTOR CONTROLLER, designed to exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the IC, making it suitable for various applications.

Nominal Supply Voltage (Vsup): 12 V

Operates at a common supply voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliable performance in demanding environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers excellent conductivity and corrosion resistance for long-lasting connections.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability in automotive applications.

Technical Specifications

Motion Control ICs DRV3203QPHPRQ1 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH THE RANGE OF 4.5V TO 18V AND 18V TO 28.5V SUPPLY

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

27 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

5.3 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

DRV3203QPHPRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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