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DM81LS97AJ

Texas Instruments

DM81LS97AJ by Texas Instruments

The Texas Instruments DM81LS97AJ is a TTL technology bus driver with 4 bits and 2 functions. It has a propagation delay of 17 ns at 5V, operates b/w 0-70°C, and supports up to 16A output current. Ideal for enabling low control in commercial-grade applications requiring true output polarity.

Median Price

$2.475

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,684 parts In-Stock

1+ parts

$2.270

100+ parts

$2.220

1k+ parts

$2.180

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2,684

$2.270

$2.220

$2.180

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DigiKey

USA . 2,684 parts In-Stock

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$2.680

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2,684

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$2.680

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Distributors (In-Stock)

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Digiode

USA . 2,298 parts In-Stock

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$2.574

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$2.574

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Vyrian

USA . 1,329 parts In-Stock

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$2.680

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1,329

$2.680

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Anansix

USA . 1,291 parts In-Stock

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A&K Electronics

USA . 20 parts In-Stock

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Rotakorn

Sweden . 20 parts In-Stock

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

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Corphita

USA . 4,197 parts In-Stock

1+ parts

$2.439

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4,197

$2.439

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Component Stockers USA

USA . 3,802 parts In-Stock

1+ parts

$2.630

100+ parts

$2.480

1k+ parts

$2.240

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3,802

$2.630

$2.480

$2.240

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Andel Nordic

Denmark . 2,861 parts In-Stock

1+ parts

$11.414

100+ parts

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$10.957

10k+ parts

$10.957

2,861

$11.414

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$10.957

$10.957

Parana Technologies

USA . 1,009 parts In-Stock

1+ parts

$18.048

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$18.196

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1,009

$18.048

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$18.196

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DigiPath Technology Company

USA . 7 parts In-Stock

1+ parts

$19.873

100+ parts

$18.284

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7

$19.873

$18.284

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ChromeModa Solutions

Germany . 3,722 parts In-Stock

1+ parts

$20.279

100+ parts

$16.629

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3,722

$20.279

$16.629

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IDEA Electronic Components Group

UK . 2,020 parts In-Stock

1+ parts

$20.279

100+ parts

$19.265

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$18.251

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2,020

$20.279

$19.265

$18.251

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Northwest PG Solutions

USA . 923 parts In-Stock

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923

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Native Components

USA . 391 parts In-Stock

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391

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Overview

Upgrade your electronic designs with the DM81LS97AJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers and transceivers that offer unmatched performance and reliability. Whether you're working on industrial automation, telecommunications, or automotive applications, this product provides the perfect solution for your needs. With its advanced features and innovative technology, you can trust that the DM81LS97AJ will deliver exceptional value, benefits, and advantages to all customers. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package material provides excellent thermal properties and durability, ensuring reliable performance in various operating conditions.

Propagation Delay At Nominal Supply: 17 ns

Low propagation delay ensures quick signal transmission, making this product suitable for high-speed data communication applications.

No. of Functions: 2

Having multiple functions in a single device offers cost-effectiveness and space-saving benefits in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common voltage of 5V makes integration with other components straightforward and simplifies power supply requirements.

Maximum I (ol): 16 Amp

High output current capability enables driving of heavy loads without the need for external amplification, enhancing overall system efficiency.

Technology: TTL

TTL technology is known for its low power consumption and robust performance, making this product suitable for a wide range of applications.

Technical Specifications

Bus Driver & Transceivers DM81LS97AJ attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-XDIP-T20

JESD-609 Code:

e0

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

21 mA

Propagation Delay At Nominal Supply:

17 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

DM81LS97AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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