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DLPR410YVA

Texas Instruments

DLPR410YVA by Texas Instruments

DLPR410YVA by Texas Instruments is a consumer IC with 48 terminals in a rectangular grid array package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Features include thin profile, fine pitch, and ball terminal form with supply voltage range of 1.65V to 2V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,381 parts In-Stock

1+ parts

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3,381

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Digiode

USA . 1,567 parts In-Stock

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1,567

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 977 parts In-Stock

1+ parts

$0.498

100+ parts

-

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977

$0.498

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Northwest PG Solutions

USA . 1,460 parts In-Stock

1+ parts

$0.548

100+ parts

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$0.483

1,460

$0.548

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-

$0.483

Parana Technologies

USA . 1,621 parts In-Stock

1+ parts

$2.696

100+ parts

$250.347

1k+ parts

$2.426

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1,621

$2.696

$250.347

$2.426

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DigiPath Technology Company

USA . 1,997 parts In-Stock

1+ parts

$2.968

100+ parts

$2.731

1k+ parts

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1,997

$2.968

$2.731

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IDEA Electronic Components Group

UK . 1,993 parts In-Stock

1+ parts

$3.029

100+ parts

-

1k+ parts

$2.726

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1,993

$3.029

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$2.726

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ChromeModa Solutions

Germany . 1,010 parts In-Stock

1+ parts

$3.029

100+ parts

$2.484

1k+ parts

-

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1,010

$3.029

$2.484

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AZTECH Wire

Italy . 480 parts In-Stock

1+ parts

$7.695

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480

$7.695

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One Stop Electronics

USA . 923 parts In-Stock

1+ parts

$14.800

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923

$14.800

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Corphita

USA . 4,854 parts In-Stock

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4,854

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Microchip USA

USA . 309 parts In-Stock

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309

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Perfect Parts

USA . 7 parts In-Stock

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7

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Overview

Experience next-level performance and reliability with the DLPR410YVA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality in every product. This consumer IC is designed for a variety of applications, offering unmatched value and benefits to customers. Say goodbye to average performance and hello to exceptional results with the DLPR410YVA.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, reducing production costs and time.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and organized form factor for the IC, making it easy to integrate into various electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and ensure reliable performance in demanding applications.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows for versatility in usage scenarios, making this IC suitable for both indoor and outdoor applications.

Terminal Form: BALL

The ball terminal form provides a reliable connection and allows for easy soldering onto the circuit board, ensuring stable electrical connections.

Maximum Supply Voltage (Vsup): 2 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources, offering flexibility in design and implementation.

Technical Specifications

Other Function Consumer ICs DLPR410YVA attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-XBGA-B48

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

DLPR410YVA General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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