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DLPR910AYVA

Texas Instruments

DLPR910AYVA by Texas Instruments

DLPR910AYVA by Texas Instruments is a consumer IC with 48 terminals in a grid array package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. It has a thin profile and fine pitch design, making it ideal for compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,874 parts In-Stock

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8,874

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Digiode

USA . 2,502 parts In-Stock

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2,502

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 936 parts In-Stock

1+ parts

$0.526

100+ parts

-

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936

$0.526

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Northwest PG Solutions

USA . 138 parts In-Stock

1+ parts

$0.579

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138

$0.579

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Parana Technologies

USA . 404 parts In-Stock

1+ parts

$3.511

100+ parts

-

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$4.036

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404

$3.511

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$4.036

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DigiPath Technology Company

USA . 2,337 parts In-Stock

1+ parts

$3.866

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2,337

$3.866

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IDEA Electronic Components Group

UK . 2,157 parts In-Stock

1+ parts

$3.945

100+ parts

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$3.550

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2,157

$3.945

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$3.550

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ChromeModa Solutions

Germany . 2,138 parts In-Stock

1+ parts

$3.945

100+ parts

$3.235

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2,138

$3.945

$3.235

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AZTECH Wire

Italy . 433 parts In-Stock

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$11.280

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433

$11.280

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One Stop Electronics

USA . 1,203 parts In-Stock

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$18.800

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1,203

$18.800

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Microchip USA

USA . 2,392 parts In-Stock

1+ parts

$461.340

100+ parts

$449.040

1k+ parts

$442.890

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$436.740

2,392

$461.340

$449.040

$442.890

$436.740

Corphita

USA . 3,295 parts In-Stock

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3,295

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Unleash the power of cutting-edge technology with the DLPR910AYVA by Texas Instruments. Crafted with precision and expertise, this consumer IC offers unparalleled quality and reliability for a wide range of applications. From enhancing electronic devices to optimizing industrial processes, this product delivers exceptional performance and efficiency. Experience seamless integration and superior functionality with Texas Instruments' DLPR910AYVA, setting new standards in innovation and excellence. Elevate your projects and elevate your results with this top-of-the-line solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand varying environmental conditions.

Surface Mount: YES

Easy to mount on circuit boards, saving time and effort in assembly.

Package Shape: RECTANGULAR

Compact shape that allows for efficient use of space on the circuit board.

No. of Terminals: 48

Sufficient number of terminals for connecting various components within the circuit.

Maximum Operating Temperature: 85 °C

Can operate effectively within a wide temperature range, making it suitable for different environments.

Minimum Operating Temperature: -40 °C

Can withstand freezing temperatures, extending its range of applications.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage requirement for efficient power consumption.

Maximum Supply Voltage (Vsup): 2 V

Operates within a safe voltage range, preventing damage to the circuit.

Technical Specifications

Other Function Consumer ICs DLPR910AYVA attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B48

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

DLPR910AYVA General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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