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DLPA2005ERSLR

Texas Instruments

DLPA2005ERSLR by Texas Instruments

DLPA2005ERSLR by Texas Instruments is a 48-terminal graphics display driver with serial data input mode. It operates b/w -10 to 85 °C, supporting multiplexed displays at 36 MHz. Ideal for LED display driver applications due to its compact square chip carrier package style.

Median Price

$10.530

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 13 parts In-Stock

1+ parts

$10.530

100+ parts

$7.023

1k+ parts

$6.391

10k+ parts

$6.206

13

$10.530

$7.023

$6.391

$6.206

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,563 parts In-Stock

1+ parts

$9.272

100+ parts

-

1k+ parts

-

10k+ parts

-

1,563

$9.272

-

-

-

Vyrian

USA . 1,897 parts In-Stock

1+ parts

$9.760

100+ parts

-

1k+ parts

-

10k+ parts

-

1,897

$9.760

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 400 parts In-Stock

1+ parts

$2.302

100+ parts

-

1k+ parts

$2.803

10k+ parts

-

400

$2.302

-

$2.803

-

DigiPath Technology Company

USA . 72 parts In-Stock

1+ parts

$2.535

100+ parts

-

1k+ parts

-

10k+ parts

-

72

$2.535

-

-

-

ChromeModa Solutions

Germany . 1,952 parts In-Stock

1+ parts

$2.587

100+ parts

$2.121

1k+ parts

-

10k+ parts

-

1,952

$2.587

$2.121

-

-

IDEA Electronic Components Group

UK . 256 parts In-Stock

1+ parts

$2.587

100+ parts

-

1k+ parts

$2.328

10k+ parts

-

256

$2.587

-

$2.328

-

Corphita

USA . 3,860 parts In-Stock

1+ parts

$8.784

100+ parts

-

1k+ parts

-

10k+ parts

-

3,860

$8.784

-

-

-

Microchip USA

USA . 2,285 parts In-Stock

1+ parts

$14.930

100+ parts

$14.710

1k+ parts

$14.610

10k+ parts

$14.500

2,285

$14.930

$14.710

$14.610

$14.500

Authorized Procurement Solutions

USA . 38,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

38,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 10,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,992

-

-

-

-

Lixinc

USA . 9,804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,804

-

-

-

-

Alle Elektronik GmbH

Germany . 4,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,328

-

-

-

-

Kepictronics

USA . 2,258 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,258

-

-

-

-

Assy Fe

Spain . 1,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,324

-

-

-

-

Native Components

USA . 826 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

826

-

-

-

-

Northwest PG Solutions

USA . 405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

405

-

-

-

-

Overview

Elevate your display experience with the DLPA2005ERSLR by Texas Instruments – a cutting-edge Graphics Display Driver that offers unmatched quality and reliability. Designed with precision by a trusted manufacturer, this product is perfect for a wide range of applications. From its sleek package shape to its innovative terminal finish, every detail is crafted to perfection. With a minimum supply voltage of 2.7V and a maximum operating temperature of 85°C, this driver ensures optimal performance in any environment. Enhance your visual displays today with the DLPA2005ERSLR and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Data Input Mode: SERIAL

Allows for easy and efficient data input, making the product user-friendly and compatible with various systems.

Surface Mount: YES

Enables easy installation on circuit boards, saving space and facilitating mass production.

Maximum Supply Voltage: 6 V

Can handle higher voltage levels, providing flexibility in power supply options for the product.

Package Shape: SQUARE

A compact and uniform shape that is easy to handle and integrate into different systems.

No. of Terminals: 48

Sufficient number of terminals for effective connectivity and functionality within the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package style that promotes efficient heat dissipation and overall product performance.

Minimum Supply Voltage: 2.7 V

Allows for operation at lower voltage levels, saving energy and enhancing product efficiency.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments without compromising performance or reliability.

Minimum Operating Temperature: -10 °C

Suitable for use in cold conditions, providing versatility and reliability in different operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures stable electrical connections for improved product longevity.

Terminal Position: QUAD

Quad terminal positioning allows for efficient signal transmission and connectivity within the product.

Maximum Seated Height: 1 mm

Low seated height design contributes to a sleek and compact product profile.

Width: 6 mm

Optimal width measurement for easy integration and compatibility with standard electronic components.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time allowed for reflow processes, ensuring proper soldering and assembly of the product.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable and robust soldering during manufacturing.

Length: 6 mm

Compact length dimension for efficient placement and utilization within electronic systems.

Multiplexed Display Capability: YES

Facilitates the display of multiple segments simultaneously, enhancing the product's display versatility.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations and manufacturing standards.

Nominal Supply Voltage: 3.6 V

Stable and optimal supply voltage level for consistent and efficient product performance.

No. of Segments: 3

Sufficient number of segments for displaying information or data effectively on the product's display.

Terminal Pitch: 0.4 mm

Close terminal pitch for enhanced connectivity and signal transmission efficiency within the product.

Minimum fmax: 36 MHz

High minimum fmax value for fast processing and data transmission speeds, improving overall product performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate level of sensitivity to moisture, providing adequate protection for the product during storage and handling.

Interface IC Type: LED DISPLAY DRIVER

Specific interface IC type designed for LED display drivers, ensuring compatibility and optimal performance.

Technical Specifications

Graphics Display Drivers DLPA2005ERSLR attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

YES

No. of Functions:

1

No. of Segments:

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Minimum fmax:

36 MHz

Trade Compliance

DLPA2005ERSLR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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