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DLPA2000DYFFR

Texas Instruments

DLPA2000DYFFR by Texas Instruments

DLPA2000DYFFR by Texas Instruments is a Graphics Display Driver with 56 terminals in a rectangular package. It operates b/w -10 to 85 °C, supporting a supply voltage range of 2.7V to 6V. Ideal for LED display driver applications with multiplexed display capability and serial data input mode.

Median Price

$8.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,039 parts In-Stock

1+ parts

$8.100

100+ parts

$5.318

1k+ parts

$4.816

10k+ parts

$4.670

1,039

$8.100

$5.318

$4.816

$4.670

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 422 parts In-Stock

1+ parts

$7.534

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422

$7.534

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Vyrian

USA . 535 parts In-Stock

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$7.930

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535

$7.930

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Cyclops Electronics Ltd

UK . 1,081 parts In-Stock

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Bristol Electronics

USA . 94 parts In-Stock

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Prism Electronics

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1

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Distributors (Availability)

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Parana Technologies

USA . 287 parts In-Stock

1+ parts

$3.556

100+ parts

-

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$4.079

10k+ parts

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287

$3.556

-

$4.079

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DigiPath Technology Company

USA . 1,136 parts In-Stock

1+ parts

$3.916

100+ parts

$3.603

1k+ parts

-

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1,136

$3.916

$3.603

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Corohmni

South Africa . 292 parts In-Stock

1+ parts

$3.952

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292

$3.952

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ChromeModa Solutions

Germany . 1,280 parts In-Stock

1+ parts

$3.996

100+ parts

$3.277

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1,280

$3.996

$3.277

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IDEA Electronic Components Group

UK . 120 parts In-Stock

1+ parts

$3.996

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$3.596

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120

$3.996

-

$3.596

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Corphita

USA . 114 parts In-Stock

1+ parts

$7.137

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114

$7.137

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$13.634

100+ parts

$12.407

1k+ parts

$11.180

10k+ parts

-

50

$13.634

$12.407

$11.180

-

Microchip USA

USA . 2,805 parts In-Stock

1+ parts

$25.940

100+ parts

$25.790

1k+ parts

$25.710

10k+ parts

$25.630

2,805

$25.940

$25.790

$25.710

$25.630

Authorized Procurement Solutions

USA . 62,000 parts In-Stock

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Lixinc

USA . 11,846 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,534 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Metaverse IC Inc.

Canada . 2,361 parts In-Stock

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2,361

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Native Components

USA . 259 parts In-Stock

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Northwest PG Solutions

USA . 33 parts In-Stock

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Perfect Parts

USA . 1 parts In-Stock

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Overview

Enhance your visual experience with the DLPA2000DYFFR by Texas Instruments, a top-tier manufacturer known for its unparalleled quality and reliability. As a leader in the Graphics Display Drivers category, this product offers seamless data input via SERIAL mode, making it ideal for a wide range of applications. From vibrant LED displays to interactive digital signage, this innovative solution provides customers with exceptional value, superior performance, and endless possibilities. Upgrade your display technology today with the DLPA2000DYFFR - where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the graphics display driver, ensuring a longer lifespan.

Data Input Mode: SERIAL

The serial data input mode allows for efficient and fast communication with other devices, making it suitable for demanding applications.

Surface Mount: YES

Surface mount capability enables easy installation and integration into compact electronic designs.

Maximum Supply Voltage: 6 V

A maximum supply voltage of 6V allows for compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor, ideal for space-constrained applications.

No. of Terminals: 56

Having 56 terminals allows for versatile connectivity options and control of multiple functions.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with fine pitch and thin profile offers high reliability and performance in demanding environments.

Minimum Supply Voltage: 2.7 V

With a minimum supply voltage of 2.7V, the graphics display driver can operate efficiently even in low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10°C allows for operation in cold environments without risking damage.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and resistance to corrosion, ensuring signal integrity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, enhancing the ease of assembly.

Maximum Seated Height: 0.625 mm

Low maximum seated height of 0.625mm saves space and enables a more compact design layout.

Width: 3.28 mm

With a width of 3.28mm, the graphics display driver can fit into narrow spaces or tight layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperatures for up to 30 seconds ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for a secure soldering process without damaging the graphics display driver.

Length: 3.484 mm

A length of 3.484mm helps in accommodating the necessary components and connections within the design.

Multiplexed Display Capability: YES

Multiplexed display capability allows for efficient control of multiple segments or displays, enhancing the functionality of the graphics display driver.

Terminal Form: BALL

The terminal form of ball provides mechanical robustness and secure electrical connections, ensuring long-term reliability.

Nominal Supply Voltage: 3.6 V

A nominal supply voltage of 3.6V provides stable and consistent power to the graphics display driver for optimal performance.

No. of Segments: 3

Having 3 segments allows for segmented display capabilities, making it suitable for various display applications.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4mm, the graphics display driver offers high-density packaging and efficient board space utilization.

Minimum fmax: 36 MHz

A minimum fmax of 36MHz indicates high-speed performance and capability to handle data processing at a fast rate.

Interface IC Type: LED DISPLAY DRIVER

The interface IC type of LED display driver ensures compatibility with LED displays, making it suitable for driving and controlling LED panels.

Technical Specifications

Graphics Display Drivers DLPA2000DYFFR attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

3.484 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

YES

No. of Functions:

1

No. of Segments:

3

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.28 mm

Minimum fmax:

36 MHz

Trade Compliance

DLPA2000DYFFR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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