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TLC5927IDBQRG4

Texas Instruments

TLC5927IDBQRG4 by Texas Instruments

TLC5927IDBQRG4 by Texas Instruments is a graphics display driver with 16 segments, operating at 30 MHz. It features a serial data input mode and supports supply voltages of 3.3V/5V. Ideal for LED displays in automotive applications due to its small outline package and wide temperature range from -40°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 68,500 parts In-Stock

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68,500

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Vyrian

USA . 5,621 parts In-Stock

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5,621

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Digiode

USA . 2,290 parts In-Stock

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2,290

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Parana Technologies

USA . 1,076 parts In-Stock

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$5.215

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$5.827

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1,076

$5.215

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$5.827

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IDEA Electronic Components Group

UK . 1,045 parts In-Stock

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$5.859

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$5.273

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1,045

$5.859

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$5.273

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ChromeModa Solutions

Germany . 516 parts In-Stock

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$5.859

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$4.804

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516

$5.859

$4.804

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AZTECH Wire

Italy . 197 parts In-Stock

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$14.693

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Corohmni

South Africa . 675 parts In-Stock

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$14.824

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$14.824

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Ampacity Inc.

Singapore . 1,278 parts In-Stock

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$18.500

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One Stop Electronics

USA . 741 parts In-Stock

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$23.500

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741

$23.500

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Semicontronic

India . 1,605 parts In-Stock

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$46.500

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$45.338

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$45.105

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Argo Parts USA

USA . 3,956 parts In-Stock

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Corphita

USA . 3,691 parts In-Stock

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DigiPath Technology Company

USA . 1,458 parts In-Stock

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$5.282

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Continental Prestige Electronics

USA . 1,245 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Enhance your display projects with the TLC5927IDBQRG4 by Texas Instruments, a top-notch Graphics Display Driver that delivers exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this product boasts a cutting-edge design and superior quality that ensures seamless operation. Ideal for a wide range of applications, this driver offers customers unmatched value, benefits, and advantages, making it the perfect choice for your graphic display needs. Upgrade your projects today with the TLC5927IDBQRG4 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and reliable for long-term use.

Data Input Mode: SERIAL

Serial data input mode offers efficient and reliable communication, ensuring accurate display control without interference.

Surface Mount: YES

Surface mount design allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage provides flexibility in power source options, allowing for compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular package shape is compact and space-efficient, ideal for applications where size constraints are a concern.

Power Supplies (V): 3.3/5

Support for multiple power supply options (3.3V and 5V) enhances compatibility with various devices and systems.

No. of Terminals: 24

High number of terminals enables versatile connectivity and integration capabilities, accommodating complex display driver requirements.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style offers a space-saving solution, making it suitable for compact electronic devices and applications.

Minimum Supply Voltage: 3 V

Low minimum supply voltage supports energy-efficient operation, reducing power consumption and extending battery life in portable devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh environments or applications that may experience elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40°C to 125°C) allows for operation in extreme conditions, making the product suitable for automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and solderability for durable and reliable connections.

Terminal Position: DUAL

Dual terminal position enhances signal transmission and connectivity, reducing the risk of signal interference and improving overall performance.

Maximum Seated Height: 1.75 mm

Low maximum seated height enables a slim and compact design for the product, ideal for space-constrained applications or PCB layouts.

Width: 3.9 mm

Narrow width dimension allows for efficient use of board space and enables high-density mounting for optimal layout and design flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature (30 seconds) reduces the risk of thermal damage and ensures reliable solder connections during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature (260°C) supports lead-free soldering processes, meeting industry standards for environmental compliance.

Length: 8.65 mm

Compact length dimension allows for space-efficient placement on PCBs, contributing to overall system miniaturization and streamlined design.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive applications, meeting industry standards for performance and durability.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections and reliable signal transmission.

Nominal Supply Voltage: 3.3 V

Stable and reliable nominal supply voltage (3.3V) supports consistent performance and compatibility with a wide range of electronic devices and systems.

No. of Segments: 16

Multi-segment design (16 segments) offers flexible display control options, allowing for customizable and dynamic visual outputs.

Terminal Pitch: 0.635 mm

Fine terminal pitch (0.635mm) supports high-density mounting and precise connections, enabling efficient signal transfer and reliable performance.

Minimum fmax: 30 MHz

High minimum fmax frequency (30 MHz) ensures fast data processing and signal transmission, supporting high-speed performance for graphics display drivers.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 (MSL 2) indicates robust moisture resistance, ensuring reliability in humid or damp environments and during soldering processes.

Interface IC Type: LED DISPLAY DRIVER

LED display driver interface IC type offers efficient control and management of LED displays, making the product suitable for various lighting and display applications.

Technical Specifications

Graphics Display Drivers TLC5927IDBQRG4 attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

2

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

30 MHz

Trade Compliance

TLC5927IDBQRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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