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DAC811JUG4

Texas Instruments

DAC811JUG4 by Texas Instruments

DAC811JUG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of ±10 V, settling time of 4 us, and linearity error of 0.0244%. It is used in applications requiring precise analog signal generation such as industrial automation and test equipment.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 4,229 parts In-Stock

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Digiode

USA . 701 parts In-Stock

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Northwest PG Solutions

USA . 104 parts In-Stock

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$2.711

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AZTECH Wire

Italy . 541 parts In-Stock

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$6.149

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Parana Technologies

USA . 2,353 parts In-Stock

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$15.595

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$15.969

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DigiPath Technology Company

USA . 829 parts In-Stock

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$17.173

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ChromeModa Solutions

Germany . 6,782 parts In-Stock

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$17.523

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$14.369

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IDEA Electronic Components Group

UK . 619 parts In-Stock

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$17.523

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$16.647

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$15.771

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One Stop Electronics

USA . 808 parts In-Stock

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$35.000

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QUARKTWIN TECHNOLOGY LTD

USA . 21,855 parts In-Stock

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Lixinc

USA . 12,266 parts In-Stock

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Corphita

USA . 3,921 parts In-Stock

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Glotronic Ltd.

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Microchip USA

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Native Components

USA . 385 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of precision with the Texas Instruments DAC811JUG4 Digital-to-Analog Converter. Manufactured by a trusted industry leader, this versatile component offers maximum analog output voltage of 10V, fast settling times, and exceptional linearity error control. Ideal for a wide range of applications, from communication systems to industrial automation, this product provides reliable performance and accuracy. Experience the value and benefits of superior quality with the DAC811JUG4 - your key to seamless integration and optimal functionality.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

Higher maximum analog output voltage allows for greater flexibility and precision in signal generation.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the converter.

Surface Mount: YES

Surface mount capability makes installation and integration of the converter into electronic circuits easier and more efficient.

No. of Bits: 12

Having 12 bits allows for a higher resolution and accuracy in the analog-to-digital conversion process.

Maximum Settling Time: 4 us

Fast settling time ensures quick and accurate conversion of digital signals to analog output.

Maximum Linearity Error (EL): 0.0244 %

Low linearity error ensures that the output closely follows the digital input, resulting in accurate signal conversion.

Power Supplies(V): 5, +-12/+-15

Versatility in power supply options allows for compatibility with a wide range of electronic systems.

No. of Terminals: 28

Having 28 terminals enables connectivity to various components in the circuit, enhancing the converter's functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and ensures efficient use of PCB real estate.

Nominal Settling Time (tstl): 3 us

Fast settling time contributes to the accuracy and responsiveness of the analog output signals.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in diverse environmental conditions.

Technical Specifications

Digital-to-Analog Converters DAC811JUG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

Bipolar

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary, Offset Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

35 mA

Maximum Settling Time:

4 µs

Sample Rate:

250 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

12 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5,±12/±15 V

Nominal Negative Supply Voltage:

-12 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

DAC811JUG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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