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DAC5682ZIRGC25

Texas Instruments

DAC5682ZIRGC25 by Texas Instruments

DAC5682ZIRGC25 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 4.1V and min of 2.5V. It operates in industrial temperature range (-40 to 85 °C) and has a settling time of 0.0104us, making it ideal for precision applications requiring high-speed performance. The chip carrier package style with very thin profile and surface mount capability ensures space-efficient design integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,827 parts In-Stock

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7,827

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Digiode

USA . 1,166 parts In-Stock

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1,166

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 290 parts In-Stock

1+ parts

$14.964

100+ parts

$1,389.594

1k+ parts

$13.467

10k+ parts

-

290

$14.964

$1,389.594

$13.467

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DigiPath Technology Company

USA . 663 parts In-Stock

1+ parts

$16.477

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663

$16.477

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IDEA Electronic Components Group

UK . 1,410 parts In-Stock

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$16.813

100+ parts

$15.972

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$15.132

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1,410

$16.813

$15.972

$15.132

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ChromeModa Solutions

Germany . 709 parts In-Stock

1+ parts

$16.813

100+ parts

$13.787

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709

$16.813

$13.787

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AZTECH Wire

Italy . 387 parts In-Stock

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$17.490

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387

$17.490

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One Stop Electronics

USA . 1,095 parts In-Stock

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$37.000

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1,095

$37.000

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Northwest PG Solutions

USA . 1,778 parts In-Stock

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Corphita

USA . 1,195 parts In-Stock

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1,195

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Microchip USA

USA . 473 parts In-Stock

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473

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Native Components

USA . 76 parts In-Stock

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76

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Overview

Experience superior quality and performance with the Texas Instruments DAC5682ZIRGC25 Digital-to-Analog Converter. Known for their precision engineering, Texas Instruments delivers reliable products that exceed industry standards. Ideal for a wide range of applications, this converter offers unparalleled value and benefits to customers seeking high-quality analog output voltage with fast settling times and a wide temperature range. Trust Texas Instruments for cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Maximum Analog Output Voltage: 4.1 V

Provides a high maximum output voltage, allowing for a wide range of analog signal levels to be accurately converted.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable.

Surface Mount: YES

Allows for easy integration into modern electronic circuit designs.

No. of Bits: 16

Offers high resolution and accuracy in converting digital signals to analog.

Power Supplies (V): 1.8, 3.3

Supports multiple power supply options for flexibility in different circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides options for different mounting styles based on the application requirements.

Nominal Settling Time (tstl): 0.0104 us

Offers fast settling time for quick response to input changes.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments with reliability.

Technical Specifications

Digital-to-Analog Converters DAC5682ZIRGC25 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Nominal Settling Time (tstl):

10.4 ns

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

2.5 V

Maximum Analog Output Voltage:

4.1 V

Power Supplies:

1.8,3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

64

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Trade Compliance

DAC5682ZIRGC25 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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