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DAC2815BP

Texas Instruments

DAC2815BP by Texas Instruments

DAC2815BP by Texas Instruments is a 12-bit D/A converter with max analog output voltage of ±13.6 V, settling time of 10 us, and linearity error of 0.0122%. Ideal for industrial applications requiring precise analog signal generation in temperature range -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,062 parts In-Stock

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Digiode

USA . 913 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 1 parts In-Stock

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Native Components

USA . 58 parts In-Stock

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$0.480

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$0.461

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Northwest PG Solutions

USA . 1,777 parts In-Stock

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$0.528

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$0.466

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Parana Technologies

USA . 2,322 parts In-Stock

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$5.744

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$6.536

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DigiPath Technology Company

USA . 2,360 parts In-Stock

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$6.325

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$5.819

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$6.325

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ChromeModa Solutions

Germany . 6,114 parts In-Stock

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$6.454

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$5.292

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IDEA Electronic Components Group

UK . 1,850 parts In-Stock

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$6.454

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$5.809

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One Stop Electronics

USA . 1,959 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 406 parts In-Stock

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$11.509

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Corphita

USA . 3,980 parts In-Stock

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Assy Fe

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Kepictronics

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Overview

Experience the unmatched quality and precision of the DAC2815BP by Texas Instruments, a leading manufacturer in digital-to-analog converters. This versatile device offers a maximum analog output voltage of 13.6V, making it ideal for a wide range of applications. With its fast settling time and minimal linearity error, this converter delivers reliable performance every time. Trust in Texas Instruments to provide top-of-the-line products that exceed expectations and add value to your projects. Elevate your designs with the DAC2815BP and unlock endless possibilities.

Feature Benefit Bullets

Maximum Analog Output Voltage: 13.6 V

High maximum analog output voltage allows for a wider range of output signals to be generated, making this product versatile and suitable for a variety of applications.

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material for the package body provides good protection and reliability for the internal components of the digital-to-analog converter.

No. of Functions: 2

Having multiple functions adds flexibility and enhances the capabilities of the digital-to-analog converter, allowing for more complex signal processing tasks to be performed.

No. of Bits: 12

A higher number of bits results in higher resolution and accuracy in the conversion process, making this product suitable for demanding applications that require precise analog outputs.

Maximum Settling Time: 10 us

Fast settling time ensures quick and accurate conversion of digital signals into analog outputs, making this product ideal for applications where speed is crucial.

Power Supplies (V): 5,+-12/+-15

The flexibility in power supply voltages allows for compatibility with a wide range of systems and environments, making this product versatile and easy to integrate.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function reliably in harsh environments or under heavy load, providing consistent performance.

Technical Specifications

Digital-to-Analog Converters DAC2815BP attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

BIMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.0122 %

Nominal Settling Time (tstl):

3.5 µs

Maximum Settling Time:

10 µs

No. of Bits:

12

No. of Functions:

2

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-13.6 V

Maximum Analog Output Voltage:

13.6 V

Power Supplies:

5,±12/±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.472 in (37.4 mm)

Maximum Seated Height:

0.25 in (6.35 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T28

Trade Compliance

DAC2815BP Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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