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DAC2815AP

Texas Instruments

DAC2815AP by Texas Instruments

DAC2815AP by Texas Instruments is a 12-bit D/A converter with max analog output voltage of ±13.6 V and settling time of 10 us. Ideal for industrial applications, it operates in temperature range -40 to 85 °C and supports input format parallel, 8 bits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,193 parts In-Stock

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Digiode

USA . 3,071 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 15 parts In-Stock

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Component Sense

UK . 1 parts In-Stock

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Northwest PG Solutions

USA . 1,245 parts In-Stock

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$3.146

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Parana Technologies

USA . 1,772 parts In-Stock

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$6.647

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$7.361

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DigiPath Technology Company

USA . 1,296 parts In-Stock

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$7.320

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$6.734

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ChromeModa Solutions

Germany . 2,367 parts In-Stock

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$7.469

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$6.125

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$7.469

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IDEA Electronic Components Group

UK . 1,476 parts In-Stock

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$7.469

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$6.722

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AZTECH Wire

Italy . 878 parts In-Stock

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$18.010

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One Stop Electronics

USA . 1,878 parts In-Stock

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$21.000

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Corphita

USA . 2,654 parts In-Stock

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Native Components

USA . 401 parts In-Stock

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Assy Fe

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Kepictronics

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Overview

Unleash the power of precision with the DAC2815AP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital-to-Analog Converters that offer unparalleled performance and reliability. Whether you're in need of high-resolution audio output or precise voltage control, this product has got you covered. With its wide range of applications and superior functionality, the DAC2815AP is the perfect solution for your digital signal processing needs. Experience the value and benefits that this cutting-edge technology brings to your projects today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 13.6 V

Provides a high maximum analog output voltage for versatile applications.

Package Body Material: PLASTIC/EPOXY

Combination of plastic and epoxy material ensures durability and reliability.

No. of Functions: 2

Having multiple functions adds versatility and flexibility to the product.

No. of Bits: 12

Higher number of bits results in higher resolution and accuracy of conversion.

Maximum Settling Time: 10 us

Fast settling time ensures quick and accurate analog output.

Power Supplies (V): 5,+-12/+-15

Can be powered by a variety of voltages for compatibility with different systems.

Temperature Grade: INDUSTRIAL

Can operate reliably in industrial temperature environments.

Input Format: PARALLEL, 8 BITS

Supports parallel input format with 8 bits for efficient data transfer.

Technical Specifications

Digital-to-Analog Converters DAC2815AP attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

BIMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

3.5 µs

Maximum Settling Time:

10 µs

No. of Bits:

12

No. of Functions:

2

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-13.6 V

Maximum Analog Output Voltage:

13.6 V

Power Supplies:

5,±12/±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.472 in (37.4 mm)

Maximum Seated Height:

0.25 in (6.35 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T28

Trade Compliance

DAC2815AP Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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