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DAC2814AP

Texas Instruments

DAC2814AP by Texas Instruments

DAC2814AP by Texas Instruments is a 12-bit D/A converter with max analog output voltage of ±13.6 V and settling time of 10 us. Ideal for industrial applications, it operates in temperature range -40 to 85 °C and supports input formats like serial with 24 terminals in an inline package style.

Median Price

$22.410

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 211 parts In-Stock

1+ parts

-

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$19.400

1k+ parts

$17.360

10k+ parts

$16.340

211

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$19.400

$17.360

$16.340

DigiKey

USA . 211 parts In-Stock

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-

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$22.410

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$22.410

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Verical

USA . 211 parts In-Stock

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$24.250

1k+ parts

$21.700

10k+ parts

$20.425

211

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$24.250

$21.700

$20.425

Distributors (In-Stock)

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Digiode

USA . 666 parts In-Stock

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$20.472

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$20.472

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Vyrian

USA . 8,395 parts In-Stock

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8,395

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DigiKey Marketplace

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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Holdelec - ElecDif-Pro

France . 5 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 418 parts In-Stock

1+ parts

$18.127

100+ parts

-

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$18.270

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418

$18.127

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$18.270

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Corphita

USA . 2,687 parts In-Stock

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$19.395

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$19.395

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ChromeModa Solutions

Germany . 3,324 parts In-Stock

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$20.367

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$16.701

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$20.367

$16.701

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IDEA Electronic Components Group

UK . 60 parts In-Stock

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$20.367

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$19.349

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$18.330

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60

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$18.330

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One Stop Electronics

USA . 75 parts In-Stock

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$39.870

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$39.870

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Microchip USA

USA . 261 parts In-Stock

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$51.540

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$50.650

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$50.200

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$49.750

261

$51.540

$50.650

$50.200

$49.750

Native Components

USA . 59 parts In-Stock

1+ parts

$70.790

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$67.958

59

$70.790

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$67.958

Northwest PG Solutions

USA . 2,206 parts In-Stock

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$77.869

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$77.869

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DigiPath Technology Company

USA . 645 parts In-Stock

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$18.363

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Assy Fe

Spain . 137 parts In-Stock

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Kepictronics

USA . 50 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments DAC2814AP Digital-to-Analog Converter. As a leader in semiconductor technology, Texas Instruments delivers unmatched quality and reliability. Perfect for industrial applications, this converter offers fast settling time and exceptional linearity, ensuring accurate output voltage up to ±13.6V. Experience superior performance and value with the DAC2814AP – trust Texas Instruments for all your digital-to-analog conversion needs.

Feature Benefit Bullets

Maximum Analog Output Voltage: 13.6 V

Provides a high maximum analog output voltage, allowing for a wide range of output values.

No. of Bits: 12

Having 12 bits ensures high resolution and accuracy in the conversion process.

Maximum Settling Time: 10 us

Fast settling time ensures quick response and accurate conversion results.

Power Supplies (V): 5,+-12/+-15

Supports multiple power supply configurations, providing flexibility in different operating environments.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, making it suitable for industrial applications.

Technology: HYBRID

Hybrid technology combines the benefits of different technologies, offering improved performance and reliability.

Technical Specifications

Digital-to-Analog Converters DAC2814AP attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

Hybrid

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

3.5 µs

Maximum Settling Time:

10 µs

No. of Bits:

12

No. of Functions:

2

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-13.6 V

Maximum Analog Output Voltage:

13.6 V

Power Supplies:

5,±12/±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

24

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.22 in (30.99 mm)

Maximum Seated Height:

0.25 in (6.35 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T24

Trade Compliance

DAC2814AP Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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