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DAC2813AP

Texas Instruments

DAC2813AP by Texas Instruments

DAC2813AP by Texas Instruments is a 12-bit D/A converter with +-15V power supplies, 10V max analog output voltage, and 6us settling time. Ideal for industrial applications requiring precise analog signal generation in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,250 parts In-Stock

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Digiode

USA . 3,139 parts In-Stock

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3,139

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EMSNET

USA . 631 parts In-Stock

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631

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Sogenti Electronics

Canada . 2 parts In-Stock

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ECAB

Sweden . 1 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 914 parts In-Stock

1+ parts

$0.053

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-

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$0.050

914

$0.053

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$0.050

Parana Technologies

USA . 779 parts In-Stock

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$6.308

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$7.058

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779

$6.308

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$7.058

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ChromeModa Solutions

Germany . 4,461 parts In-Stock

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$7.088

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$5.812

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$7.088

$5.812

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IDEA Electronic Components Group

UK . 250 parts In-Stock

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$7.088

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$6.379

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$7.088

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AZTECH Wire

Italy . 352 parts In-Stock

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$14.690

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352

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One Stop Electronics

USA . 2,236 parts In-Stock

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$25.000

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$25.000

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DigiPath Technology Company

USA . 2,102 parts In-Stock

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$6.391

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Corphita

USA . 2,066 parts In-Stock

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Northwest PG Solutions

USA . 1,409 parts In-Stock

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Assy Fe

Spain . 150 parts In-Stock

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Overview

Experience unparalleled precision and performance with the Texas Instruments DAC2813AP, a top-of-the-line Digital-to-Analog Converter designed to elevate your projects to new heights. Crafted by the industry-leading manufacturer, Texas Instruments, this innovative device boasts exceptional quality and reliability. Ideal for a wide range of applications, the DAC2813AP delivers a maximum analog output voltage of 10V and offers impressive linearity accuracy to enhance your systems. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations – unlock endless possibilities with the DAC2813AP.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

Provides a high maximum analog output voltage, allowing for a wide range of output signals.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for various applications.

No. of Functions: 2

Having 2 functions enhances the versatility and functionality of the product.

No. of Bits: 12

With 12 bits, the product offers high resolution and accuracy in converting digital signals to analog.

Maximum Settling Time: 6 us

Fast settling time ensures rapid response and accuracy in signal conversion.

Power Supplies (V): +-12/+-15

Supports a wide range of power supplies, making it compatible with various systems.

Maximum Operating Temperature: 85 °C

Operates efficiently even in high-temperature environments, suitable for industrial use.

Technical Specifications

Digital-to-Analog Converters DAC2813AP attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

Hybrid

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.0122 %

Nominal Settling Time (tstl):

4.5 µs

Maximum Supply Current:

30 mA

Maximum Settling Time:

6 µs

No. of Bits:

12

No. of Functions:

2

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

±12/±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.472 in (37.4 mm)

Maximum Seated Height:

0.25 in (6.35 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T28

Trade Compliance

DAC2813AP Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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