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CY74FCT646TQCTE4

Texas Instruments

CY74FCT646TQCTE4 by Texas Instruments

The Texas Instruments CY74FCT646TQCTE4 is an 8-bit bus driver with a propagation delay of 9ns at 5V. It features a small outline package, operates b/w -40 to 85°C, and has independent control for bidirectional data flow. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,682 parts In-Stock

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5,682

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Digiode

USA . 4,127 parts In-Stock

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4,127

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Distributors (Availability)

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Native Components

USA . 432 parts In-Stock

1+ parts

$0.032

100+ parts

-

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$0.030

432

$0.032

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$0.030

Andel Nordic

Denmark . 4,930 parts In-Stock

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$7.206

100+ parts

-

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$6.918

10k+ parts

$6.918

4,930

$7.206

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$6.918

$6.918

AZTECH Wire

Italy . 552 parts In-Stock

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$12.470

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552

$12.470

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Parana Technologies

USA . 531 parts In-Stock

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$13.875

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$14.352

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531

$13.875

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$14.352

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DigiPath Technology Company

USA . 45 parts In-Stock

1+ parts

$15.278

100+ parts

$14.056

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45

$15.278

$14.056

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ChromeModa Solutions

Germany . 2,696 parts In-Stock

1+ parts

$15.590

100+ parts

$12.784

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2,696

$15.590

$12.784

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IDEA Electronic Components Group

UK . 1,531 parts In-Stock

1+ parts

$15.590

100+ parts

$14.810

1k+ parts

$14.031

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1,531

$15.590

$14.810

$14.031

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One Stop Electronics

USA . 1,272 parts In-Stock

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$24.000

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1,272

$24.000

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Northwest PG Solutions

USA . 1,688 parts In-Stock

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1,688

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Corphita

USA . 1,526 parts In-Stock

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Microchip USA

USA . 447 parts In-Stock

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Overview

Unlock seamless data transmission with the Texas Instruments CY74FCT646TQCTE4 bus driver and transceiver. Trusted for its superior quality and reliability, Texas Instruments delivers cutting-edge technology that meets the demands of industrial applications. With a compact design and fast propagation delay, this 8-bit device ensures smooth data transfer with minimal power consumption. Experience the value of efficient signal processing and enhance your system performance with the CY74FCT646TQCTE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceivers.

Propagation Delay At Nominal Supply: 9 ns

Ensures fast signal transmission and response times, making the product efficient in data communication applications.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement that is commonly available, ensuring compatibility with various systems.

Power Supplies (V): 5

Consistent power supply for stable operation of the bus driver & transceivers.

Maximum I (ol): 64 Amp

High output current capability, suitable for driving different loads in a circuit.

Output Characteristics: 3-STATE

Ability to provide high impedance state when disabled, enhancing flexibility in circuit design.

Technology: CMOS

Low power consumption and high noise immunity characteristics of CMOS technology offer reliable performance.

Technical Specifications

Bus Driver & Transceivers CY74FCT646TQCTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G24

Length:

8.65 mm

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

CY74FCT646TQCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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