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CY74FCT240CTQCTG4

Texas Instruments

CY74FCT240CTQCTG4 by Texas Instruments

CY74FCT240CTQCTG4 by Texas Instruments is a 20-terminal bus driver with 4.3ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V and has a load capacitance of 50pF. With surface mount capability and inverted output polarity, it offers efficient signal transmission in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,906 parts In-Stock

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Digiode

USA . 859 parts In-Stock

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Native Components

USA . 32 parts In-Stock

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$1.410

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Northwest PG Solutions

USA . 1,926 parts In-Stock

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$1.551

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Andel Nordic

Denmark . 449 parts In-Stock

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$6.388

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$6.133

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449

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AZTECH Wire

Italy . 605 parts In-Stock

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$19.270

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Parana Technologies

USA . 1,968 parts In-Stock

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$19.682

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$19.678

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ChromeModa Solutions

Germany . 1,035 parts In-Stock

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$22.115

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IDEA Electronic Components Group

UK . 983 parts In-Stock

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One Stop Electronics

USA . 917 parts In-Stock

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$51.000

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Microchip USA

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DigiPath Technology Company

USA . 1,028 parts In-Stock

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Corphita

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Overview

Experience seamless and reliable data transmission with the CY74FCT240CTQCTG4 by Texas Instruments. Crafted with precision using high-quality materials, this bus driver & transceiver ensures fast propagation delay and low power consumption, making it ideal for a wide range of applications. Trust in Texas Instruments' reputation for delivering cutting-edge technology and innovation. Unlock the potential of your projects with the value and benefits that this product offers, providing you with a competitive edge in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and reliability for long-term use in various operating conditions.

Propagation Delay At Nominal Supply: 4.3 ns

Provides fast signal transmission, making it suitable for high-speed communication applications.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards.

No. of Functions: 2

Offers versatility and flexibility in functionality for different applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage requirements, making it widely usable.

Load Capacitance (CL): 50 pF

Optimized for driving capacitive loads, ensuring signal integrity.

Power Supplies (V): 5

Consistent power supply voltage for stable operation.

No. of Terminals: 20

Provides sufficient connectivity options for interfacing with other components.

Maximum I (ol): 64 Amp

Capable of driving high current loads with ease.

Output Characteristics: 3-STATE

Enables tri-state output operation for additional control flexibility.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers CY74FCT240CTQCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

4.3 ns

Propagation Delay (tpd):

4.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CY74FCT240CTQCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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