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CY74FCT157ATQCTE4

Texas Instruments

CY74FCT157ATQCTE4 by Texas Instruments

CY74FCT157ATQCTE4 by Texas Instruments is a 4:1 multiplexer with 5ns propagation delay, suitable for industrial applications. It operates at a supply voltage of 5V and has a max operating temperature of 85°C. With surface mount capability and small outline package style, it offers high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,535 parts In-Stock

1+ parts

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7,535

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Digiode

USA . 3,705 parts In-Stock

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3,705

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Distributors (Availability)

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AZTECH Wire

Italy . 807 parts In-Stock

1+ parts

$6.570

100+ parts

-

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807

$6.570

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One Stop Electronics

USA . 1,138 parts In-Stock

1+ parts

$15.000

100+ parts

-

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1,138

$15.000

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Parana Technologies

USA . 329 parts In-Stock

1+ parts

$22.769

100+ parts

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$23.432

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329

$22.769

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$23.432

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DigiPath Technology Company

USA . 2,303 parts In-Stock

1+ parts

$25.071

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2,303

$25.071

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ChromeModa Solutions

Germany . 2,547 parts In-Stock

1+ parts

$25.583

100+ parts

$20.978

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2,547

$25.583

$20.978

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IDEA Electronic Components Group

UK . 894 parts In-Stock

1+ parts

$25.583

100+ parts

$24.304

1k+ parts

$23.025

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894

$25.583

$24.304

$23.025

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Native Components

USA . 177 parts In-Stock

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$120.535

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$115.714

177

$120.535

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$115.714

Northwest PG Solutions

USA . 245 parts In-Stock

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$132.589

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$132.589

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Corphita

USA . 3,306 parts In-Stock

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Overview

Elevate your electronic designs with the CY74FCT157ATQCTE4 by Texas Instruments, a versatile multiplexer & demultiplexer that offers unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this product is perfect for a wide range of applications. With its 3-STATE output characteristics and fast propagation delay of just 5 ns, this small outline, shrink pitch package delivers exceptional performance. Trust in Texas Instruments to provide innovative solutions that exceed expectations and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it easy to handle and resistant to damage during handling or installation.

Propagation Delay At Nominal Supply: 5 ns

The low propagation delay of 5 ns ensures fast signal processing, making the multiplexer/demultiplexer suitable for high-speed data applications.

No. of Functions: 4

With the ability to handle 4 functions, this multiplexer/demultiplexer offers versatility and flexibility in data routing and selection.

No. of Inputs: 2

Having 2 inputs allows for dual signal handling, providing options for input sources and enhancing the functionality of the device.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Technical Specifications

Multiplexer & Demultiplexer CY74FCT157ATQCTE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CY74FCT157ATQCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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