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CY74FCT157ATSOCTE4

Texas Instruments

CY74FCT157ATSOCTE4 by Texas Instruments

CY74FCT157ATSOCTE4 by Texas Instruments is a 4:1 multiplexer with 5ns propagation delay at 5V. It has 2 inputs, operates in industrial temperature range (-40 to 85 °C), and features a small outline package. Ideal for applications requiring fast switching b/w multiple input signals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,844 parts In-Stock

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Digiode

USA . 4,650 parts In-Stock

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Parana Technologies

USA . 768 parts In-Stock

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$8.346

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$8.974

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768

$8.346

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$8.974

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DigiPath Technology Company

USA . 1,062 parts In-Stock

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$9.189

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ChromeModa Solutions

Germany . 203 parts In-Stock

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$9.377

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$7.689

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IDEA Electronic Components Group

UK . 56 parts In-Stock

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$9.377

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$8.908

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$8.439

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56

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$8.439

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AZTECH Wire

Italy . 671 parts In-Stock

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$15.311

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One Stop Electronics

USA . 1,612 parts In-Stock

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$58.000

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Corphita

USA . 4,594 parts In-Stock

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Northwest PG Solutions

USA . 1,816 parts In-Stock

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Native Components

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Microchip USA

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Overview

Discover the innovative CY74FCT157ATSOCTE4 by Texas Instruments, a high-quality Multiplexer & Demultiplexer that delivers unmatched performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product is perfect for a wide range of applications. From telecommunications to industrial automation, this versatile device offers customers exceptional value, benefits, and advantages. Experience fast propagation delay, low power consumption, and precise output characteristics with the CY74FCT157ATSOCTE4. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 5 ns

Low propagation delay ensures fast and efficient signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and saves space on the PCB, making the product suitable for compact designs.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, making the product cost-effective and efficient.

No. of Inputs: 2

With 2 inputs, this multiplexer can efficiently handle signal switching between two sources, providing flexibility in the system design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration with other components easier and ensures compatibility with various systems.

Load Capacitance (CL): 50 pF

Having a specified load capacitance ensures proper signal transmission and reception, maintaining signal integrity within the system.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance state when not in use, reducing signal interference and improving overall system performance.

Technical Specifications

Multiplexer & Demultiplexer CY74FCT157ATSOCTE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CY74FCT157ATSOCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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