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CDCV855PWR

Texas Instruments

CDCV855PWR by Texas Instruments

CDCV855PWR clock driver by Texas Instruments operates at 2.5V with 28 terminals and a load capacitance of 14pF. It features a propagation delay of 4.5ns, output in 3-STATE, and can handle up to 12A current. Ideal for applications requiring differential input conditioning and a max operating temperature of 70°C.

Median Price

$2.900

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Rochester

USA . 342 parts In-Stock

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$1.500

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$1.470

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$1.440

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DigiKey

USA . 425 parts In-Stock

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$4.300

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$2.711

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$2.575

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$2.324

425

$4.300

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$2.324

Distributors (In-Stock)

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Digiode

USA . 73 parts In-Stock

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$3.325

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Vyrian

USA . 4,703 parts In-Stock

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

France . 697 parts In-Stock

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Pegasus Components GmbH

Germany . 400 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 100 parts In-Stock

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Prism Electronics

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Native Components

USA . 935 parts In-Stock

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$1.128

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Northwest PG Solutions

USA . 1,604 parts In-Stock

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$1.240

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Ampacity Inc.

Singapore . 385 parts In-Stock

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$2.980

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Corphita

USA . 3,639 parts In-Stock

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$3.150

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Andel Nordic

Denmark . 3,018 parts In-Stock

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$6.131

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$5.886

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$5.886

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$6.131

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$5.886

$5.886

Advanced Electronics

New Zealand . 300 parts In-Stock

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$20.075

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$19.874

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$19.071

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$20.075

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Parana Technologies

USA . 1,632 parts In-Stock

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$27.425

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$35.669

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DigiPath Technology Company

USA . 1,801 parts In-Stock

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$30.199

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ChromeModa Solutions

Germany . 3,215 parts In-Stock

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$30.815

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$25.268

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IDEA Electronic Components Group

UK . 2,201 parts In-Stock

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$30.815

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$29.274

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$27.734

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Component Stockers USA

USA . 527 parts In-Stock

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Metaverse IC Inc.

Canada . 4,984 parts In-Stock

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Alle Elektronik GmbH

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Cyclops Electronics Ltd (Excess)

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Futuretech Components

Singapore . 529 parts In-Stock

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Overview

Unleash the power of precise clock distribution with the Texas Instruments CDCV855PWR. Designed with quality and precision in mind, this clock driver offers unparalleled performance in a wide range of applications. From enhancing system reliability to improving signal integrity, this product delivers exceptional value and benefits to customers seeking reliable clock drivers for their projects. Experience the advantages of Texas Instruments' expertise and innovation with the CDCV855PWR, the perfect solution for your clock driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring reliability and longevity.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Input Conditioning: DIFFERENTIAL

Enables the clock driver to process signals with improved accuracy and noise rejection, leading to more precise output timing.

Propagation Delay (tpd): 4.5 ns

Low propagation delay ensures fast signal processing and minimizes latency in clock distribution, ideal for high-speed applications.

Minimum Operating Temperature: 0 °C

Can operate effectively in a wide range of temperatures, making it suitable for various environmental conditions.

No. of True Outputs: 4

Provides multiple output channels for driving clock signals to different components, improving flexibility in system design.

Technical Specifications

Clock Drivers & Buffers CDCV855PWR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

855

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

14 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

180 MHz

Trade Compliance

CDCV855PWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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