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CDCP1803RGET

Texas Instruments

CDCP1803RGET by Texas Instruments

Texas Instruments CDCP1803RGET is a clock driver with 0.6 ns propagation delay at 3.3V, suitable for industrial applications. It features 24 terminals in a square package shape, with differential input conditioning and 3-STATE output characteristics. This surface-mount chip carrier has a very thin profile and operates b/w -40 to 85°C.

Median Price

$6.357

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Chip1Stop

Japan . 4 parts In-Stock

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$4.980

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Texas Instruments

USA . 5,343 parts In-Stock

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$6.427

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$5.240

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$3.493

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$6.427

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Mouser Electronics

USA . 276 parts In-Stock

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$9.190

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$6.640

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$5.420

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$5.420

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Rochester

USA . 26,018 parts In-Stock

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$5.030

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$4.500

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$4.230

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DigiKey

USA . 26,018 parts In-Stock

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$6.610

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Verical

USA . 18,844 parts In-Stock

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$6.287

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$5.625

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$5.287

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$5.287

Arrow

USA . 1 parts In-Stock

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Digiode

USA . 3,702 parts In-Stock

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$2.104

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Vyrian

USA . 2,008 parts In-Stock

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$2.215

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DigiKey Marketplace

USA . 26,138 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Bristol Electronics

USA . 818 parts In-Stock

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PC Components Company LLC

USA . 548 parts In-Stock

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Electronics Depot

USA . 166 parts In-Stock

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Zilex Electronics Inc.

Canada . 132 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 98 parts In-Stock

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Prism Electronics

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North Shore Components

USA . 16 parts In-Stock

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Semtec, LLC

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Native Components

USA . 118 parts In-Stock

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$1.124

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$1.124

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Northwest PG Solutions

USA . 1,223 parts In-Stock

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$1.236

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Corphita

USA . 1,509 parts In-Stock

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$1.994

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Component Stockers USA

USA . 39,641 parts In-Stock

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$4.330

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$4.730

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$4.270

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$4.270

39,641

$4.330

$4.730

$4.270

$4.270

Andel Nordic

Denmark . 616 parts In-Stock

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$11.526

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$11.065

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$11.065

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$11.065

Parana Technologies

USA . 589 parts In-Stock

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$29.935

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$64.926

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DigiPath Technology Company

USA . 1,057 parts In-Stock

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$32.962

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$30.325

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ChromeModa Solutions

Germany . 3,981 parts In-Stock

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$33.635

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$27.581

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IDEA Electronic Components Group

UK . 1,437 parts In-Stock

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$33.635

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$31.953

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$30.272

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Lixinc

USA . 10,650 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,204 parts In-Stock

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GreenTree Electronics

Israel . 3,836 parts In-Stock

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Metaverse IC Inc.

Canada . 2,230 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 283 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 70 parts In-Stock

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Overview

Enhance your electronic designs with the CDCP1803RGET by Texas Instruments, a top-tier clock driver & buffer that guarantees precision and reliability. Crafted by a renowned manufacturer, this product ensures superior performance and durability. Ideal for a wide range of applications, this chip carrier with very thin profile offers unmatched value with its fast propagation delay of 0.6ns and low power consumption. Elevate your projects with the latest technology and experience seamless integration like never before. Choose Texas Instruments for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 0.6 ns

The low propagation delay ensures accurate and efficient signal transmission in high-speed applications.

Surface Mount: YES

Being surface mountable makes installation quick and easy, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and interference, leading to reliable signal processing.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common and widely compatible, making it suitable for a variety of systems and circuits.

No. of True Outputs: 3

Having multiple true outputs allows for versatile signal routing and distribution options in the circuit design.

Technical Specifications

Clock Drivers & Buffers CDCP1803RGET attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

1803

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Minimum fmax:

800 MHz

Trade Compliance

CDCP1803RGET Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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