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CDCP1803RGETG4

Texas Instruments

CDCP1803RGETG4 by Texas Instruments

Texas Instruments CDCP1803RGETG4 is a clock driver with 0.6 ns propagation delay, 3.3V supply voltage, and 24 terminals. It is used in industrial applications for differential input conditioning and 800 MHz min fmax, suitable for surface mount with a square package shape.

Median Price

$11.220

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 117 parts In-Stock

1+ parts

$11.220

100+ parts

$7.230

1k+ parts

$4.900

10k+ parts

-

117

$11.220

$7.230

$4.900

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,307 parts In-Stock

1+ parts

$7.980

100+ parts

-

1k+ parts

-

10k+ parts

-

3,307

$7.980

-

-

-

Vyrian

USA . 7,719 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,719

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 265 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

-

265

$0.569

-

-

-

Northwest PG Solutions

USA . 2,295 parts In-Stock

1+ parts

$0.626

100+ parts

-

1k+ parts

-

10k+ parts

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2,295

$0.626

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-

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Andel Nordic

Denmark . 3,385 parts In-Stock

1+ parts

$3.548

100+ parts

-

1k+ parts

$3.406

10k+ parts

$3.406

3,385

$3.548

-

$3.406

$3.406

Corphita

USA . 4,896 parts In-Stock

1+ parts

$7.560

100+ parts

-

1k+ parts

-

10k+ parts

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4,896

$7.560

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-

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Parana Technologies

USA . 610 parts In-Stock

1+ parts

$24.537

100+ parts

-

1k+ parts

$25.203

10k+ parts

-

610

$24.537

-

$25.203

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DigiPath Technology Company

USA . 934 parts In-Stock

1+ parts

$27.019

100+ parts

-

1k+ parts

-

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934

$27.019

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-

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ChromeModa Solutions

Germany . 6,611 parts In-Stock

1+ parts

$27.570

100+ parts

$22.607

1k+ parts

-

10k+ parts

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6,611

$27.570

$22.607

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IDEA Electronic Components Group

UK . 1,961 parts In-Stock

1+ parts

$27.570

100+ parts

$26.192

1k+ parts

$24.813

10k+ parts

-

1,961

$27.570

$26.192

$24.813

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QUARKTWIN TECHNOLOGY LTD

USA . 11,469 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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11,469

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Microchip USA

USA . 4,591 parts In-Stock

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4,591

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Overview

Enhance your electronic designs with the CDCP1803RGETG4 clock driver & buffer by Texas Instruments. Crafted with precision and expertise, this product offers unparalleled performance and reliability. Ideal for a wide range of applications, this clock driver ensures seamless signal transmission and synchronization. Elevate your projects with the superior quality and innovation that Texas Instruments is known for. Trust in the CDCP1803RGETG4 to deliver exceptional results, making it a valuable asset for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material ensures durability and reliability for long-term use.

Propagation Delay at Nominal Supply: 0.6 ns

Low propagation delay ensures fast response times and efficient operation.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning results in improved signal quality and noise immunity.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, making it compatible with a wide range of systems.

Power Supplies (V): 3.3

Consistent power supply of 3.3V ensures stable performance.

No. of Terminals: 24

Sufficient number of terminals for connecting to other components and peripherals.

Maximum Operating Temperature: 85°C

Wide operating temperature range allows for use in various environments.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling the output signal.

Minimum Operating Temperature: -40°C

Capable of operating in low-temperature conditions without issues.

Technical Specifications

Clock Drivers & Buffers CDCP1803RGETG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

1803

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Minimum fmax:

800 MHz

Trade Compliance

CDCP1803RGETG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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