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CDCP1803MRGETEP

Texas Instruments

CDCP1803MRGETEP by Texas Instruments

Texas Instruments CDCP1803MRGETEP is a clock driver with 0.6 ns propagation delay, 3.3V supply voltage, and 24 terminals. It is used in applications requiring differential input conditioning and 800 MHz min fmax, suitable for military-grade temperature environments.

Median Price

$12.980

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 244 parts In-Stock

1+ parts

$17.410

100+ parts

$13.515

1k+ parts

-

10k+ parts

-

244

$17.410

$13.515

-

-

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$8.550

1k+ parts

$7.650

10k+ parts

$7.200

1

-

$8.550

$7.650

$7.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,369 parts In-Stock

1+ parts

$9.025

100+ parts

-

1k+ parts

-

10k+ parts

-

1,369

$9.025

-

-

-

Vyrian

USA . 6,844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,844

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,006 parts In-Stock

1+ parts

$2.990

100+ parts

-

1k+ parts

$2.871

10k+ parts

$2.871

3,006

$2.990

-

$2.871

$2.871

Corphita

USA . 1,279 parts In-Stock

1+ parts

$8.550

100+ parts

-

1k+ parts

-

10k+ parts

-

1,279

$8.550

-

-

-

AZTECH Wire

Italy . 326 parts In-Stock

1+ parts

$9.350

100+ parts

-

1k+ parts

-

10k+ parts

-

326

$9.350

-

-

-

Parana Technologies

USA . 199 parts In-Stock

1+ parts

$21.526

100+ parts

-

1k+ parts

$21.911

10k+ parts

-

199

$21.526

-

$21.911

-

ChromeModa Solutions

Germany . 2,733 parts In-Stock

1+ parts

$24.186

100+ parts

$19.833

1k+ parts

-

10k+ parts

-

2,733

$24.186

$19.833

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-

IDEA Electronic Components Group

UK . 355 parts In-Stock

1+ parts

$24.186

100+ parts

$22.977

1k+ parts

$21.767

10k+ parts

-

355

$24.186

$22.977

$21.767

-

Native Components

USA . 979 parts In-Stock

1+ parts

$149.750

100+ parts

-

1k+ parts

-

10k+ parts

$143.760

979

$149.750

-

-

$143.760

Northwest PG Solutions

USA . 1,440 parts In-Stock

1+ parts

$164.725

100+ parts

-

1k+ parts

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10k+ parts

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1,440

$164.725

-

-

-

Kepictronics

USA . 820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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820

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-

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Microchip USA

USA . 118 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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118

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-

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DigiPath Technology Company

USA . 107 parts In-Stock

1+ parts

-

100+ parts

$21.806

1k+ parts

-

10k+ parts

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107

-

$21.806

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-

Overview

Enhance your electronic designs with the CDCP1803MRGETEP clock driver & buffer by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This versatile chip carrier is perfect for applications requiring precise timing control, with a propagation delay of just 0.6 ns and 3 true outputs operating at up to 800 MHz. With a minimal supply voltage of 3 V and a wide temperature range, this military-grade component offers exceptional performance and durability. Trust Texas Instruments to deliver cutting-edge solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the clock driver, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 0.6 ns

A low propagation delay ensures fast and efficient signal transmission, making this clock driver suitable for high-speed applications where timing accuracy is critical.

Surface Mount: YES

The surface mount feature allows for easy and compact installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard nominal supply voltage of 3.3V ensures compatibility with a wide range of electronic systems and devices.

Temperature Grade: MILITARY

With military-grade temperature specifications, this clock driver can withstand harsh environmental conditions, making it suitable for demanding applications in military or aerospace sectors.

Technical Specifications

Clock Drivers & Buffers CDCP1803MRGETEP attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

1803

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

.6 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Minimum fmax:

800 MHz

Trade Compliance

CDCP1803MRGETEP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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