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CDCLVP215RHBR

Texas Instruments

CDCLVP215RHBR by Texas Instruments

CDCLVP215RHBR by Texas Instruments is a clock driver with 2 functions, 0.3 ns propagation delay at 2.5V, and 10 true outputs. It operates in industrial temperature range (-40 to 85 °C) and has a max supply voltage of 3.8V. Ideal for applications requiring high-speed clock distribution in compact designs.

Median Price

$9.436

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,500 parts In-Stock

1+ parts

$9.436

100+ parts

$7.692

1k+ parts

$5.128

10k+ parts

-

5,500

$9.436

$7.692

$5.128

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,218 parts In-Stock

1+ parts

$8.964

100+ parts

-

1k+ parts

-

10k+ parts

-

2,218

$8.964

-

-

-

Vyrian

USA . 8,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,987

-

-

-

-

ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,968 parts In-Stock

1+ parts

$8.492

100+ parts

-

1k+ parts

-

10k+ parts

-

2,968

$8.492

-

-

-

Andel Nordic

Denmark . 4,694 parts In-Stock

1+ parts

$9.822

100+ parts

-

1k+ parts

$9.429

10k+ parts

$9.429

4,694

$9.822

-

$9.429

$9.429

AZTECH Wire

Italy . 674 parts In-Stock

1+ parts

$11.050

100+ parts

-

1k+ parts

-

10k+ parts

-

674

$11.050

-

-

-

Parana Technologies

USA . 606 parts In-Stock

1+ parts

$27.125

100+ parts

-

1k+ parts

$32.521

10k+ parts

-

606

$27.125

-

$32.521

-

DigiPath Technology Company

USA . 2,204 parts In-Stock

1+ parts

$29.868

100+ parts

$27.479

1k+ parts

-

10k+ parts

-

2,204

$29.868

$27.479

-

-

ChromeModa Solutions

Germany . 2,714 parts In-Stock

1+ parts

$30.478

100+ parts

$24.992

1k+ parts

-

10k+ parts

-

2,714

$30.478

$24.992

-

-

IDEA Electronic Components Group

UK . 854 parts In-Stock

1+ parts

$30.478

100+ parts

$28.954

1k+ parts

$27.430

10k+ parts

-

854

$30.478

$28.954

$27.430

-

Native Components

USA . 105 parts In-Stock

1+ parts

$291.170

100+ parts

$285.347

1k+ parts

$282.435

10k+ parts

$279.523

105

$291.170

$285.347

$282.435

$279.523

Northwest PG Solutions

USA . 887 parts In-Stock

1+ parts

$320.287

100+ parts

-

1k+ parts

-

10k+ parts

-

887

$320.287

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Enhance your electronic designs with the Texas Instruments CDCLVP215RHBR Clock Driver & Buffer. Manufactured by a trusted industry leader, this versatile component offers exceptional quality and reliability. Ideal for a wide range of applications, this chip carrier features differential input conditioning and minimal propagation delay, ensuring optimal performance. With a compact square package style and an industrial temperature grade, the CDCLVP215RHBR provides unmatched value and benefits to customers seeking high-speed clock distribution solutions. Upgrade your projects today with this innovative clock driver from Texas Instruments.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and facilitating automated assembly processes.

Input Conditioning

Differential input conditioning helps in reducing noise and enhancing signal integrity, making the product ideal for sensitive applications that require high accuracy.

Nominal Supply Voltage / Vsup (V)

Operates at a standard 2.5V supply voltage, ensuring compatibility with a wide range of systems and power sources.

No. of True Outputs

Multiple true outputs allow for versatile signal distribution and processing capabilities, increasing the product's functionality and utility.

Technical Specifications

Clock Drivers & Buffers CDCLVP215RHBR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

LVECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

215

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

90 mA

Propagation Delay At Nominal Supply:

.3 ns

Propagation Delay (tpd):

.3 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

3500 MHz

Trade Compliance

CDCLVP215RHBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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