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CDCLVP1212RHAR

Texas Instruments

CDCLVP1212RHAR by Texas Instruments

CDCLVP1212RHAR by Texas Instruments is a clock driver with 0.55 ns propagation delay, 2.5V nominal voltage, and 12 true outputs. It is used in applications requiring high-speed signal conditioning and differential multiplexing in industrial settings.

Median Price

$9.288

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,354 parts In-Stock

1+ parts

$8.485

100+ parts

$8.093

1k+ parts

$7.700

10k+ parts

-

2,354

$8.485

$8.093

$7.700

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Verical

USA . 2,354 parts In-Stock

1+ parts

$8.699

100+ parts

$7.992

1k+ parts

$7.700

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-

2,354

$8.699

$7.992

$7.700

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Texas Instruments

USA . 10,265 parts In-Stock

1+ parts

$9.877

100+ parts

$8.628

1k+ parts

$5.950

10k+ parts

-

10,265

$9.877

$8.628

$5.950

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DigiKey

USA . 1,035 parts In-Stock

1+ parts

$14.940

100+ parts

$10.170

1k+ parts

$9.310

10k+ parts

$9.007

1,035

$14.940

$10.170

$9.310

$9.007

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,519 parts In-Stock

1+ parts

$8.061

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3,519

$8.061

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Vyrian

USA . 7,953 parts In-Stock

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7,953

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Cyclops Electronics Ltd

UK . 5,765 parts In-Stock

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5,765

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Bristol Electronics

USA . 618 parts In-Stock

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618

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Component Sense

UK . 445 parts In-Stock

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445

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Sensible Micro Corp

USA . 150 parts In-Stock

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150

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Contempo Components LLC

USA . 75 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 57 parts In-Stock

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Holdelec - ElecDif-Pro

France . 57 parts In-Stock

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Native Components

USA . 771 parts In-Stock

1+ parts

$0.572

100+ parts

-

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771

$0.572

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Northwest PG Solutions

USA . 1,945 parts In-Stock

1+ parts

$0.629

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1,945

$0.629

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Andel Nordic

Denmark . 912 parts In-Stock

1+ parts

$3.135

100+ parts

-

1k+ parts

$3.010

10k+ parts

$3.010

912

$3.135

-

$3.010

$3.010

Corphita

USA . 3,086 parts In-Stock

1+ parts

$7.636

100+ parts

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3,086

$7.636

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Component Stockers USA

USA . 7,097 parts In-Stock

1+ parts

$10.030

100+ parts

$8.900

1k+ parts

$8.640

10k+ parts

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7,097

$10.030

$8.900

$8.640

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Parana Technologies

USA . 75 parts In-Stock

1+ parts

$10.575

100+ parts

-

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$11.075

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75

$10.575

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$11.075

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DigiPath Technology Company

USA . 1,252 parts In-Stock

1+ parts

$11.644

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$11.644

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IDEA Electronic Components Group

UK . 2,041 parts In-Stock

1+ parts

$11.882

100+ parts

$11.288

1k+ parts

$10.694

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2,041

$11.882

$11.288

$10.694

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ChromeModa Solutions

Germany . 724 parts In-Stock

1+ parts

$11.882

100+ parts

$9.743

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724

$11.882

$9.743

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A-Z Elektronik GmbH

Germany . 6,096 parts In-Stock

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Perfect Parts

USA . 5,611 parts In-Stock

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Futuretech Components

Singapore . 4,980 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,064 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Lixinc

USA . 1,709 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Discover the innovative CDCLVP1212RHAR Clock Driver & Buffer by Texas Instruments, a leading manufacturer known for top-quality products. Ideal for a variety of applications, this chip carrier package offers superior performance with a propagation delay of just 0.55 ns and differential mux input conditioning. With 12 true outputs and a wide operating temperature range, this clock driver provides reliable functionality in industrial settings. Experience the value and benefits of Texas Instruments' cutting-edge technology with the CDCLVP1212RHAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product will last a long time.

Propagation Delay At Nominal Supply: 0.55 ns

Low propagation delay ensures fast and efficient operation of the clock drivers.

Surface Mount: YES

Surface mount capability makes installation and integration of the product easier and more convenient.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning provides better signal integrity and noise immunity.

Nominal Supply Voltage / Vsup (V): 2.5

Standard voltage supply for compatibility with various systems.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for use in industrial settings.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures product can function in various environments.

No. of True Outputs: 12

Multiple true outputs provide flexibility in signal distribution.

Technical Specifications

Clock Drivers & Buffers CDCLVP1212RHAR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

40

No. of True Outputs:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

88 mA

Propagation Delay At Nominal Supply:

.55 ns

Propagation Delay (tpd):

.55 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Minimum fmax:

2000 MHz

Trade Compliance

CDCLVP1212RHAR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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