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CDCLVP111VFR

Texas Instruments

CDCLVP111VFR by Texas Instruments

CDCLVP111VFR by Texas Instruments is a clock driver with 0.35 ns propagation delay, 2.5 V nominal voltage, and 10 true outputs. It is used in applications requiring high-speed signal conditioning and differential multiplexing, with a temperature range of -40 to 85 °C.

Median Price

$6.762

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,688 parts In-Stock

1+ parts

$6.762

100+ parts

$5.513

1k+ parts

$3.675

10k+ parts

-

3,688

$6.762

$5.513

$3.675

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,783 parts In-Stock

1+ parts

$6.424

100+ parts

-

1k+ parts

-

10k+ parts

-

4,783

$6.424

-

-

-

Vyrian

USA . 7,561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,561

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 561 parts In-Stock

1+ parts

$0.421

100+ parts

-

1k+ parts

-

10k+ parts

$0.404

561

$0.421

-

-

$0.404

Northwest PG Solutions

USA . 886 parts In-Stock

1+ parts

$0.463

100+ parts

-

1k+ parts

-

10k+ parts

$0.408

886

$0.463

-

-

$0.408

Andel Nordic

Denmark . 870 parts In-Stock

1+ parts

$3.556

100+ parts

-

1k+ parts

$3.414

10k+ parts

$3.414

870

$3.556

-

$3.414

$3.414

Corphita

USA . 3,017 parts In-Stock

1+ parts

$6.086

100+ parts

-

1k+ parts

-

10k+ parts

-

3,017

$6.086

-

-

-

Parana Technologies

USA . 1,226 parts In-Stock

1+ parts

$10.480

100+ parts

-

1k+ parts

$10.991

10k+ parts

-

1,226

$10.480

-

$10.991

-

AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$10.480

100+ parts

-

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10k+ parts

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429

$10.480

-

-

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DigiPath Technology Company

USA . 1,125 parts In-Stock

1+ parts

$11.540

100+ parts

$10.616

1k+ parts

-

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-

1,125

$11.540

$10.616

-

-

ChromeModa Solutions

Germany . 4,558 parts In-Stock

1+ parts

$11.775

100+ parts

$9.656

1k+ parts

-

10k+ parts

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4,558

$11.775

$9.656

-

-

IDEA Electronic Components Group

UK . 891 parts In-Stock

1+ parts

$11.775

100+ parts

$11.186

1k+ parts

$10.598

10k+ parts

-

891

$11.775

$11.186

$10.598

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GreenTree Electronics

Israel . 40,248 parts In-Stock

1+ parts

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40,248

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QUARKTWIN TECHNOLOGY LTD

USA . 20,099 parts In-Stock

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20,099

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Lixinc

USA . 9,354 parts In-Stock

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9,354

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A-Z Elektronik GmbH

Germany . 7,284 parts In-Stock

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7,284

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Alle Elektronik GmbH

Germany . 4,639 parts In-Stock

1+ parts

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4,639

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

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2,000

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Metaverse IC Inc.

Canada . 857 parts In-Stock

1+ parts

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857

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Overview

Enhance your electronic designs with the Texas Instruments CDCLVP111VFR clock driver and buffer. With a reputation for quality and reliability, Texas Instruments delivers cutting-edge solutions for various applications in the clock drivers and buffers category. This versatile product offers customers unparalleled value and benefits, providing precise timing control and efficient signal conditioning. Elevate your projects with the CDCLVP111VFR and experience superior performance and seamless integration into your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, suitable for various applications.

Propagation Delay At Nominal Supply: 0.35 ns

The low propagation delay ensures fast and efficient operation of the clock driver, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable, the product can be easily integrated into PCB designs, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL MUX

The differential multiplexer input conditioning allows for precise signal handling, reducing noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is a common and widely supported voltage level, making the product compatible with a variety of systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the clock driver can withstand harsh environmental conditions and perform reliably in industrial settings.

Technical Specifications

Clock Drivers & Buffers CDCLVP111VFR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

LVECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V; ALSO OPERATES AT 3.3 V SUPPLY

Family:

111

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Maximum Power Supply Current (ICC):

85 mA

Propagation Delay At Nominal Supply:

.35 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

3500 MHz

Trade Compliance

CDCLVP111VFR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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